Methods and apparatus for simultaneously bonding a plurality of first workpieces to spaced-apart locations on at least one second workpiece. The invention is particularly suited for simultaneously bonding a plurality of lead wires to the terminal land areas of an integrated circuit or other electronic device. A deformable, compliant support member is spirally wound with a continuous metallic filament. After the spiral has been formed it is secured to the support member by any suitable adhesive means. The edges of the support member are sheared to cut the spiral windings and thus form a plurality of lead wires. The indentations which are formed on the reverse side of the support member when the spiral is cut may be used for alignment purposes. Thermal and/or mechanical bonding energy applied through the support member bonds the plurality of lead wires to the integrated circuit.
A circuit substrate includes resistive films are disposed on the surfaces of lands included in a circuit pattern and these resistive films are used as resistances connected in series to a capacitor. Therefore, the resistances are connected in series without increasing the inductance in the capacitor, and accordingly, a circuit having a small impedance variation with respect to frequency can be obtained. Therefore, it is possible to obtain a power supply circuit and so forth having stable operation and fast response.
A single point bonding tool for use in ultrasonically bonding a fine or ultrafine wire to another electrical conductor, has a thin film resistor integrally formed thereon. The thin film resistor is integrally formed on the bonding tip by standard photolithographic techniques applied to the bonding tool. The tool combines ultrasonic energy and thermal energy provided by the resistor to provide required bonding energy that may be localized both in space and in time. The result offers optimized energy transfer to the selected workpieces and minimizes risk of damage to adjacent, heat sensitive devices.
