A device for centering chip components attached to the tip of a pick and place spindle after selection from storage and prior to placement on a substrate. The need for precisely stored component chips is eliminated. A vacuum in the hollow spindle tip holds the component chip, while, in turn, cam-driven feet and fingers attached to the spindle housing push the component chip to a centered position on the spindle.

An apparatus for carrying electronic components from a supply position to an electronic circuit board or the like and placing the electronic components on the electronic circuit board or the like, which has a rod provided at its tip end with a suction tool for picking up components to be carried and which is connected with an air suction apparatus; a body frame supporting the rod for movement of the rod in the vertical and horizontal directions; two pairs of position regulating pawls which are movably supported on the rod and are supported for freely opening and closing to grasp the components from different directions which the components are held by the suction tool and positioning them; and an arrangement for opening and closing the position regulating pawls.

An article gripping apparatus selectively grips a first article having a functional surface and a non-functional surface, and an elastically deformable second article. A first contact mechanism contacting the first article includes a plurality of contact members contacting the non-functional surface of the first article, and a suction member which chucks the first article at a position where the suction member does not contact the functional surface of the first article in a state wherein the contact members are in contact with the first article.

Disclosed is a method for mounting electronic components comprising steps of sucking an electronic component such as semiconductor pellet to the tip end of an attraction nozzle, holding and automatically orienting the sucked electronic component by means of a plurality of arms arranged along the outer periphery of the tip end of the sucking nozzle, transferring the held electronic component to a predetermined bonding portion of a semiconductor device substrate such as stem, and opening the arms to bring down the electronic component onto the predetermined bonding portion for bonding. Also disclosed is an apparatus for executing this method.

The present invention provides a substrate carrying apparatus capable of surely carrying a substrate with electronic parts mounted thereon, at low costs without causing the electronic parts to fall off the substrate, and without damaging the substrate. A substrate carrying apparatus has an arm body capable of vertical and horizontal movement. The arm body is provided with a plurality of substrate suction pads capable of sticking to the upper surface of the glass substrate by suction to hold the glass substrate, and a plurality of electronic part suction pads disposed above the electronic parts so as to correspond to the electronic parts, respectively. The electronic part suction pads are capable of sticking to the upper surfaces of the electronic parts by suction to hold the electronic parts. The suction pads are connected to a suction device by suction lines. The suction pads are combined, respectively, with position adjusting mechanisms of adjusting the respective positions of the suction pads relative to the arm body. The position adjusting mechanisms adjust the respective positions of the suction pads relative to the arm body according to the size and position of the glass substrate, and the sizes and positions of the electronic parts. The electronic part suction pads are provided with springs, respectively, to enable the electronic part suction pads to come into contact with the electronic parts without exerting shocks on the electronic parts.