A method and apparatus for fabricating an aperture of predetermined cross-sectional area in an orifice plate for use in a non-contact printer, includes the steps of fabricating in the orifice plate an aperture of cross-sectional area no less than the predetermined cross-sectional area, flowing an electrolytic deposition solution under pressure through the aperture, applying a constant frequency stimulating disturbance to the stream of electrolytic deposition solution emerging from the aperture, placing an electrically conductive surface in the path of the stream and at a distance from the orifice plate equal to the unbroken filament length of said stream through an aperture of the predetermined cross-sectional area, causing the deposition solution to deposit on the walls of the aperture by connecting the orifice plate and the electrically conductive surface to opposite sides of a source of electric potential whereby the unbroken filament comprises part of the closed electro-deposition circuit, and continuing to supply the electrolytic deposition solution to the aperture until the aperture attains the predetermined cross-sectional area thereby producing filament breakup ahead of the electrically conductive surface and automatically opening the electro-deposition circuit.
The invention relates to a method for producing a high-pressure fuel reservoir for a common rail fuel injection system of an internal combustion engine, having a hollow base body (1) which is equipped with a plurality of connection openings (3). In a simple method that can be performed inexpensively, a connection bore (4) is predrilled. The communication between the connection bore (4) and the interior (2) of the base body (1) is created with the aid of a further machining method.
Method for producing a predetermined pattern of small size fluid nozzles of identical or different geometries in crystallographically oriented monocrystalline silicon or similar material utilizing anisotropic etching through the silicon to an integral etch resistant barrier layer heavily doped with P type impurities.
A method for fabricating an ink jet droplet generator. According to the disclosed technique, a metallic body is first machined to define one or more ink receiving cavities and to further define an intended nozzle surface. Resist material is applied to the nozzle surface at the intended ink nozzle positions and a thin metallic plating formed on the surface. The resist and body are then etched to form one or more passageways from the ink cavities past the regions formerly occupied by the resist. These passageways form the generator nozzles.
A device for recording comprising ejecting a liquid recording medium by heat energy which comprises a recording head composed of a discharging orifice for ejecting the liquid recording medium in a form of droplets, an inlet for introducing the liquid recording medium, a liquid chamber for holding the liquid recording medium, and a heating element for applying heat energy to the liquid recording medium in the liquid chamber, and a means for applying voltage pulse to control heating by the heating element, the distance between the surface of the heating element and the liquid recording medium being not more than 100 microns.
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight graphite having a mean particle size within the range of 0.05 to 50 microns; 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating.
