Apparatus for aiming a tool used to perform a mechanical operation on a semiconductor device, including a light pencil which directs a thin beam of light in the area where the tool is to be aimed. The position of the light beam indicates one of the positions of the moveable tool.
A micromanipulator comprises a miniature operating tool such as a needle, micro-pippet, micro-electrode or the like which is disposed on a movable member of a microscope, such as an illuminating condenser lens, which is movable in the direction of the optical axis of an objective lens.
A semiconductor wafer is sub-divided into pellets and the pellets held in their wafer alignment by using a molding compound to form a holder for the pellets. A heated bonding tool is aligned with and used to simultaneously bond a set of external leads to each semiconductor pellet in sequence. Each pellet after the external leads are bonded thereto is lifted from the holder by the leads.
A method and device for providing point of contact light or target on a work piece are provided which are particularly adapted for use with a wire bonder independent of the operator's viewing aid and which employ a high intensity light source to create a naturally colored beam of light. In accordance with one embodiment of the invention, a helium-neon laser beam is expanded and then formed into a point of light which is projected onto the work piece surface by an adjustable mirror arrangement which is positioned to reflect the specular component of the beam away from the operator's viewing sight line and which enables easy focusing and adjustment of the target spot so as to substantially reduce parallax.
An apparatus for soldering a solder on a difficultly solderable substrate comprises a vibration tip which is rotatably held and is mounted on an ultrasonic oscillation mechanism and is slidably held to the vertical direction to an object for soldering. A needle part is placed in a predetermined distance and a predetermined direction from the edge of said vibration tip and said needle part is projected in substantially the same level as that of said edge of said vibration tip.
Device for mechanically and/or electrically connecting "beam leads" to current conductors on a substrate, said device comprising a support which supports a chisel holder with a chisel connected thereto, a support for the substrate, means to position the chisel relative to the support and a microscope which is arranged straight above the chisel, and the axis of which substantially coincides with the axis of the chisel holder, said microscope having a range of definition in depth which, during positioning, comprises both the lower surface of the chisel and the upper surface of the substrate, the support having a shape which passes the rays from the chisel to the microscope to a considerable extent or consisting of an optically translucent material, the chisel holder being present substantially entirely within the region occupied by said rays.