A quantitative fluid discharge device includes an arrangement for pressurizing fluid within a container and discharging the fluid from the container at a predetermined rate. A dispense control apparatus is provided for controlling the rate of fluid discharge from the container. The dispense control apparatus includes a keyboard from which signals for effecting initialization and discharge may be input, and a microcomputer for receiving those signals from the keyboard. An interface receives a digital pressure command signal from the microcomputer, and an electropneumatic regulator receives an analog pressure command signal from this interface. The electropneumatic regulator includes an air channel, and a solenoid valve is disposed in a middle part of this air channel. A pressure sensor for detecting the discharge air pressure acting on the fluid is disposed at a location which permits detection of the discharge air pressure while the fluid is being discharged from the container.

An apparatus for controllably delivering a liquid under pressure from a supply to a first location is provided having a first structure operable for a predetermined first time interval to cause flow of a first predetermined quantity of liquid at a first pressure from the supply to the first location, and a second structure for sensing the pressure of the liquid and as an incident of sensing that the pressure of the liquid is not at the first pressure causing a compensating delivery of liquid from the supply to the first location so that the first predetermined quantity of liquid is delivered to the first location each time the first structure is operated for the first time interval. The first structure is capable of operating for a plurality of different time intervals corresponding to a plurality of different size containers selectable by a user to be filled.

This die-bonding method relates to an improvement in a method to apply high pressure air to a resin vessel under a predetermined discharge condition to discharge the resin onto a portion subject to bonding, thus to adhesively join or connect a semiconductor chip to the portion subject to bonding by the resin discharged. This method includes a process for detecting a pressure waveform applied to the resin vessel, and a process for controlling the discharge condition to compensate the difference between the pressure waveform detected and a predetermined reference pressure waveform so that a predetermined resin quantity is discharged at all times even when the quantity of resin within the resin vessel varies. There is also provided an apparatus for implementing this die-bonding method, which includes a correction circuit for performing the above compensating operation.

A beer dispensing apparatus for delivering beer to a valve that is opened to dispense a predetermined weight of the beverage by monitoring the reduced weight of the supply keg. The apparatus also includes means for bypassing a portion of the beer from the cooling coils so that a part of the beer is cooled to a non-foaming temperature and a portion of the beer is at a foaming temperature. The two portions are mixed into a mixture that forms a head on the liquid received in a beer mug or pitcher.

A metering device capable of selectively dispensing any one of a desired quantities of wine or other liquids from any one of a number of holding tanks or reservoirs in which the wines or liquid are stored. The device is particularly adapted for use in bars and restaurants, for each time it is actuated to dispense a drink a non-reset type of counter is actuated to record that a drink has been dispensed, and as a result, close control on the inventory of wine and other liquids may be maintained. After the device has been actuated it will automatically dispense a predetermined quantity of a selected liquid, allowing a bartender, waiter, waitress, or other personnel to perform other tasks during the dispensing operation.