This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.

A solderable electrically conductive composition includes metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy. The composition is formed by dissolving the vinyl in a solvent to form a solution. The solution is then mixed with the metallic silver particles and the epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvent and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix of vinyl and epoxy, on the substrate.

Thermoplastic cores reinforced with strong magnetic shots or/and particles are molded and then thermosets are molded around this thermoplastic core. The thermoplastic core is decored by a magnet at a high temperature above the softening point of thermoplastic matrix to produce a hollow curved internal space.

A conductive polymer composition which has low resistivity and good electrical stability. In one aspect the composition comprises a nonconductive filler which is a dehydrated metal oxide. In another aspect the composition comprises a conductive filler which is metal particles in which the bulk density is less than 0.15 times the true density. Compositions of the invention are particularly useful for circuit protection devices.