Process for producing a polyglycidylamino compound characterized by comprising: (I) an addition reaction step at which a diamine is reacted with an excess amount, based on diamine, of an epihalohydrin in the presence of water, (II) a primary dehydrohalogenatin reaction step at which the addition reaction mixture from the step (I) is reacted with a halogen-removing agent in the co-presence of at least one phase transfer catalyst, (III) a step at which the dehydrohalogenation reaction mixture from the step (II) is separated into an organic phase and a water phase by adding water thereto, and an unreacted epihalohydrin is distilled off from the organic phase, (IV) a step at which the reaction mixture from the step (II) is washed with water, (V) a secondary dehydrohalogenation reaction step at which the crude polyglycidylamino compound from the step (IV) is reacted with a halogen-removing agent in the co-presence of at least one phase transfer catalyst, and (VI) a step at which the dehydrohalogenation reaction mixture from the step (V) is washed with water.

Disclosed is a novel polyglycidyl compound useful as polyfunctional epoxy resins excellent in adhesion, heat resistance and strength. This novel polyglycidyl compound has the general formula: ##STR1## (wherein ##STR2## A method for producing this polyglycidyl compound is also disclosed.

The present invention provides an adhesive for laminates containing, as a main component, an epoxy resin composition comprising an epoxy resin and an epoxy resin-curing agent, the epoxy resin composition being formed into an epoxy resin cured product containing a skeleton structure represented by the formula (1): ##STR00001## in an amount of at least 40% by weight. Since the adhesive of the present invention reveals not only a suitable adhesion to various film materials but also a high gas-barrier property, only a single layer formed therefrom can realize both an excellent gas-barrier property and an excellent adhesion property in combination, so that it is possible to produce a high gas-barrier laminated film for a packaging material without forming a separate gas-barrier layer therein.

Fiber-reinforced syntactic foam composites having a low specific gravity and a coefficient of thermal expansion of about 9.0.times.10.sup.-6 in/in/.degree.F. (16.2.times.10.sup.-6 cm/cm/.degree.C.) or less are prepared from a mixture of: a heat curable thermosetting resin comprising an uncured polyglycidyl aromatic amine, a polycarboxylic acid anhydride curing agent, and a chosen curing accelerator; hollow microspheres having a diameter of about 5 to 200 micrometers; and fibers having a length less than or equal to 250 micrometers. These composites are useful for forming lightweight structures for space applications.

A highly fluid, solventless heat curable resin is formulated from an admixture comprising a polyglycidyl aromatic amine, a polycarboxylic acid anhydride curing agent, and a curing accelerator. The heat curable formulation exhibits low viscosity and is useful as an encapsulant and insulation for electrical members exposed to high electrical stress. Magnetic coils encapsulated with the cured formulation resist corona discharge at electrical stresses in excess of 2100 volts per mil.