Compliant bonding of beam-leaded semiconductor devices is improved by deforming a compliant member into apertures of a rigid bonding grid during a bonding process. The deformation of the compliant member provides a desired clearance around brittle body portions of the semiconductor devices so that the body portions remain undamaged during bonding. In one example, the deformation takes place during exertion of bonding force and, in another example, just prior to the exertion of the bonding force. In still another example, the deformation is sufficient to cause complete shearing of the compliant member so that direct viewing of the device through the compliant member for alignment purposes can be effected.
Apparatus for moving a frame of the type for supporting a plurality of integrated circuit chips or die members wherein the frame on a track is moved incrementally along the same by one or both of a pair of panels pivotally mounted below the track and normally projecting through the plane of the track and into openings in the frame. A reciprocal drive means coupled to the pawls causes the latter to reciprocate, so that the pawls, as they moves in reverse, pivot downwardly in the frame and into second frame openings, whereupon the pawls are urged forwardly and they, in turn, advance the frame through a predetermined distance. If the apparatus is used as a die bonder, an improved heat shield is provided for the heater element. Also, an improved die holder is disposed adjacent to and above the heater element. If the apparatus is used as a die test unit, an improved test probe is provided wherein test leads move in engagement with terminals of a die after the die frame has been incrementally advanced.
Device leads are compliantly bonded and external leads are directly bonded to a substrate with a single stroke of a bonding tool. The external leads are comprised in a lead frame that includes a compliant medium portion for bonding the device leads.
A power operated tool (20) functions to cut and collect a multitude of precious metal contacts (11,11) from wire spring relays (10). The tool (20) includes a pair of jaws (31,32) that in the open position fit over several rows of contacts (11,11). When the tool (20) is energized, the jaws (31,32) are snapped shut thereby severing the contacts (11,11) from the relays (28). The jaws (31,32) in the closed engaged position define a closed chamber (41) having a port (44) for attachment to a vacuum source for sucking the severed contacts (11,11) into a collection vessel. The jaws (31,32) reopen following collection and the tool (20) is ready to cut the next set of spring contacts (11,11).
Beam leaded semiconductive chips are retrieved from a tight matrix by applying a partial vacuum to a chip through a tube that is slidable in a sleeve of the transferring and joining device, the chip then being transferred to and joined to a circuit board.
A compliant bonder has a single heated tip which is raised and lowered along a bonding axis. The tip is surrounded by a turret which indexes successive portions of a continuous compliant member across the bonding axis. The turret is provided with a series of holes through a rim portion thereof. In order to index the compliant member, after a bond is completed, the turret is lowered to disengage the bonding tip from the hole in the turret. The turret is then rotated to bring the next successive one of the holes onto the bonding axis. Next, the turret is raised to re-engage the tip with the newly positioned hole. Just prior to and during bonding, the tip is forced to project out through one of the holes that is aligned with the bonding axis. A portion of the compliant member is stretched across the hole in the turret. Thus, the tip engages with the compliant member. The heated bonding tip is prevented from pre-heating the compliant member except immediately prior to and during a bonding operation. Thus, the desirable flow characteristics of the member are retained.
