In a solid coulometer comprising two opposite layers, of which one is made of active metal and the other is made of inactive metal, and a layer of solid electrolyte of high iron conductivity sandwiched between them wherein the active metal ion is migrated and deposited on the inactive metal layer on charging and then the deposited active metal ion is removed from the inactive metal layer and re-depodited on the active metal layer on discharging so that an over-voltage is produced at the completion of the re-deposition, an improvement where the opposite metal layers are buried in the solid electrolyte layer, the opposite surface area of each of the opposite metal layers being smaller than the surface area of the solid electrolyte layer contacting thereto.
An electronic flash system for an automatic camera adapted for use with sequential arrays of flashlamps and having a distributing network for sequentially firing the lamps, one for each exposure. An accessory strobe unit is provided that comprises a photocoupled trigger unit and an impedance network that simulates the impedance seen by the camera during the operation of the flashlamp array.
An electrolytic cell including an electrolyte solution, a first electrode having a cadmium surface in contact with and electrochemically active with the electrolyte and a second electrode, which is insulated or spaced from the first electrode. The second electrode has a surface in contact with and chemically inert to the solution. The electrolyte comprises a solution of an alkali metal-cadmium-iodide complex in methyl formate. The electrolytic cell may be used as a plating cell for depositing cadmium electrolytically on the surface of the second electrode. It also may be used as a coulometer, to measure the number of coulombs deposited during plating. Accordingly the cell may be used as a timing device where the superior characteristics are needed.
A cell which is arranged to allow the transfer of charges between two electrodes, includes two electrically conducting electrodes spaced apart from one another, and a solid dielectric material disposed between the electrodes, and including a certain quantity of carriers of a positive charge trapped therein.
A thin film capacitor having a top, middle and bottom plate forming two capacitors in series in which the middle plate is a plurality of isolated plates thereby forming a structure of a plurality of two capacitors in series which are all connected in parallel. The capacitor may be integrated into an electronic substrate. The capacitor may be formed by depositing films of the metal conductors and dielectrics and may be formed as an integral part of a semiconductor chip or interconnect substrate.
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be converted selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors in relatively few steps. The process is well suited for copper/polyimide substrates.
