By rounding and/or rendering obtuse at least the vertical angles of the connecting walls in a ceramic cavity which come into contact with a noble metal coating or pad therein, "peel-back" of the noble metal coating or pad is prevented.
An electronic package assembly comprising a substrate having a central recess in which a semiconductor chip can be mounted. A narrow inclined groove is cut into the edge of the recess and extends from the recess bottom to the location of a screen-printed ground lead on the surface of the substrate. Conductive paste is painted on the bottom of the recess for attachment of a chip and a portion of the paste is drawn up the groove by capillary action to form a tenacious bond with the screen-printed ground lead.
