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SURFACE CHARACTERIZATION
   
Document Number
US Patent 3733893
Issued Date
May 22, 1973
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Abstract
An apparatus for characterizing a surface, such as on a semiconductor wafer, includes a heater for establishing controlled temperature conditions, a nitrogen input, and a desiccant for establishing a controlled atmosphere at the surface. A dispensing mechanism provides a known quantity of a liquid in a droplet on the surface. The surface is characterized by determining the evaporation rate of the liquid from the surface under the controlled conditions established by the apparatus. This is usually done by measuring the time for complete evaporation of the droplet to take place. The method is especially suited for characterizing the photoresist application characteristics of semiconductor wafer surfaces.
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SURFACE CHARACTERIZATION - US Patent 3733893 Drawing
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Number of Claims:
9
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Published
May 22, 1973
Application Number
05/161,468
Filed
July 12, 1971
US Classification
73/73   73/104 73/61.77
Int'l Classification
G01N   25/00   (20060101)   G01N   25/14   (20060101)  
Examiner
USPTO Field of Search
73/104   73/64.4   73/15R   73/17A   73/73   73/76  
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