An electronic watch module and method of manufacturing the module. The module is formed from a flexible film by forming a set of appropriately located, sized and shaped component openings in the film, forming a second set of terminal lead bonding openings for the components, securing a metallic foil to said film, removing portions of said foil to form a pattern of interconnection leads for said components leaving portions over said bonding openings, locating the components in the respective openings with the component leads in registry with their respective interconnection leads, and bonding the foil leads to the component leads through the bonding openings.

A compliant bonder has a single heated tip which is raised and lowered along a bonding axis. The tip is surrounded by a turret which indexes successive portions of a continuous compliant member across the bonding axis. The turret is provided with a series of holes through a rim portion thereof. In order to index the compliant member, after a bond is completed, the turret is lowered to disengage the bonding tip from the hole in the turret. The turret is then rotated to bring the next successive one of the holes onto the bonding axis. Next, the turret is raised to re-engage the tip with the newly positioned hole. Just prior to and during bonding, the tip is forced to project out through one of the holes that is aligned with the bonding axis. A portion of the compliant member is stretched across the hole in the turret. Thus, the tip engages with the compliant member. The heated bonding tip is prevented from pre-heating the compliant member except immediately prior to and during a bonding operation. Thus, the desirable flow characteristics of the member are retained.

A method of and apparatus for effecting bonding of beam lead devices such as semiconductor integrated circuit chips to microcircuit or similar plate-like elements by use of the known compliant bonding technique in which the compliant bonding medium is of tape form, e.g. aluminum tape. Such tape medium is initially unperforated and is fed stepwise to the operative position coincident with the axis of movement of a reciprocating bonding ram where a window opening of appropriate size to accommodate the device to be bonded is formed therein by displaceable punching mechanism before the actual bonding step. A multiple punch turret provides a choice of window openings of different dimensions to accommodate different size devices. The compliant medium tape may be formed with an embossed region around each window opening by using the bonding ram as a forming tool in co-operation with an embossing die on the opposite side of the tape. A selection of different bonding rams may be provided on a rotatable turret as well as a number of different embossing dies on a further turret.

A method of manufacturing printed circuit sheets which is capable of efficiently manufacturing printed circuit sheets from a base sheet composed of a base material in a sheet form having applied at least on one surface an electrically conductive foil.

A process and apparatus are provided for applying gold contacts to a metal member by superposing a gold foil element with the metal member, ultrasonically welding a portion of the gold foil to the member, and stripping the unwelded portion from the metal member to leave the welded portion attached to the member. The apparatus comprises an ultrasonic welding unit, a welding zone for receiving and superposing the foil element and metal member, a stripping plate disposed in the welding zone between the element and the member, having an opening therein for superposing and welding the element and member. The gold foil element is welded to the metal member and the stripping plate separates the unwelded portion of the gold foil from the welded portion to leave the welded portion of the gold foil attached to the metal member.