An abrasive and cushioned composite comprising: (a) a tough, stretchable first sheet of silicone polymer, (b) abrasive particulate adherent to and protruding from at least one side of the first sheet, (c) other sheet means providing a cushioned support for said first sheet and combined therewith.

The current invention relates to a lens surfacing assembly and a method for grinding and polishing glass or plastic optical lenses. The assembly is primarily intended for use with a rigid lapping tool and a typical lens grinding machine. The lens surfacing assembly comprises a strippable adhesive member that is attached to the lapping tool for use throughout the grinding and polishing operation for attachment of a reversible, double sided lens surfacing pad having a coarse surface on one side and a fine surface on the other. After the grinding has been completed, the reversible pad is removed and a polishing cloth is attached to the adhesive member. The combined thickness of the pad and the adhesive member is equal to the compensation designed into the radius of curvature of the lapping tool arcuate surface. The combined thickness of the polishing cloth and the adhesive member is also equal to the compensation designed into the lapping tool.

A flexible cosmetic abrasive sheet comprises (a) a tough, flexible sheet of silicone polymer, (b) abrasive particulate carried by and protruding from at least one side of the sheet and exposed for rubbing contact with human skin during use of the sheet. A layer of reticulated, resiliently compressible foam may be attached to the abrasive sheet, for light dermabrasion.

A method for flattening an inter-layer insulating film of a semiconductor device of a multi-wiring is carried out with a chemical-mechanical polishing process by using an apparatus, which includes two-layer polishing cloth having an unwoven cloth and a hard foamed layer affixed on a support plate. In order to fluff on a surface of the hard foamed layer or recreate on the whole surface thereof, a tool is provided on the polishing cloth. A silicon wafer is held through a backing pad so that an insulating film of a semiconductor device formed on the wafer is polished by the polishing cloth by rotation of the support plate and the wafer, and at the same time the surface layer of the polishing cloth is fluffed by the tool provided with a polishing surface having the curvature as that of the backing pad. Therefore, a polishing rate can be kept stable, and uniformity of polishing quantity is improved.

A filter grip includes a sheet with a first surface and a second surface, both surfaces having a grit texture. The sheet defines a radius of curvature. The filter grip is configured to provide a non-slip engagement between a user's hand or tool and an oil filter.