A tool for removing integrated circuit packages from the sockets of a burn-in board includes a plurality of parallel elongated prongs spaced from one another by an amount corresponding to the distance between adjacent rows of sockets on the burn-in board. A cover including a protective layer, such as of foam material, is mounted for pivotal movement with respect to the prongs. To remove the integrated circuit packages from the burn-in board following a burn-in procedure, the prongs are inserted along the longitudinal spaces between adjacent rows of sockets and the free end of the cover is latched to the prongs. The prongs are then lifted upwards, thereby to remove the integrated circuit packages from the sockets.

A manually held universal extraction tool for removing integrated circuits from sockets. The tool as disclosed can be operated with one hand and primarily includes a plunger located within a barrel movable therewith, the barrel having a hooked member attached thereto. The barrel is movable upwardly and the amount of upward movement is controlled by an adjustment member so that the hook moved with the barrel will lift the integrated circuit from the socket, when the hook is placed in the relief formed between the integrated circuit in socket.

Chilling or freezing a substance into small pellets is disclosed. A substance such as liquid egg falls gently from only a small height onto the surface (12) of liquid nitrogen. The discharge nozzle (13) is prevented from freezing up by a flow of ambient or heated air over it. The surface of the boiling nitrogen is kept smooth by imparting a velocity to the nitrogen with an impeller (20) or by running the nitrogen along a trough. The pellets are consistent as to final temperature, and the process is efficient as to nitrogen use. The process can be used with other thick, creamy substances.

A method and apparatus for automatically extracting a series of integrated circuit packages from their sockets without bending the leads thereof. A plurality of extraction fingers are caused to be moved between a socket mounting an integrated circuit package and the package to an extent to permit the package to be extracted from its socket in a direction substantially perpendicular to the plane of the socket. The extracted packages are controlled after their release to cause them to travel through a checking station to determine the condition of their leads. The integrated circuit packages that have not been damaged will continue to travel down an incline and be accumulated. The damaged integrated circuit package will be held at the checking station and then ejected automatically from the apparatus during the operation of an extraction cycle.

A parallel roller tool for quickly and carefully unloading groups of semiconductor devices from spring-biased semiconductor device sockets. The parallel roller tool has a plurality of roller support plates which support the rollers and may serve to align them with various socket rows. Use of this roller tool permits rapid unloading of trays containing semiconductor devices without overstressing the trays or touching the semiconductor devices with the tool.