In compositions of noble metal(s) dispersed in an inert vehicle which are useful for forming electrodes on dielectric substrates, improved electrode compositions comprising an amount of NiO effective to increase fired conductor adhesion to substrates; since the resultant fired electrodes have increased adhesion to ceramic dielectric substrates, they have special utility in forming surface metallizations in electronic circuits.
Metallization suitable for making printed thick film terminations comprising an admixture of finely divided particles of palladium/silver as the conductive phase and bismuth-free low-melting, low viscosity devitrifiable glass as the binder phase. The composition optionally contains a spinel-forming metal oxide to raise substrate adhesion.
Before assembling a gas discharge panel the active surfaces of the chromium-containing electrodes which constitute the cathodes are covered with a layer of sufficient thickness of platinum, aluminum or nickel which can prevent the formation of chromium oxide.
A ceramic substrate having a conductive pattern coating thereon wherein the coating comprises an admixture of finely divided particles of a noble metal or alloy, a low melting low viscosity glass, a spinel-forming metal oxide and an organo titantate and the process of making same.
Disclosed herein are powder compositions useful for making conductors, e.g., microcircuit conductors, end terminations for capacitors, electrodes for gas discharge display devices, etc. The compositions comprise inorganic powders dispersed in an inert vehicle and are printed and fired in the conventional manner on dielectric substrates. The inorganic powders comprise a mixture of nickel and/or aluminum or copper and boron. Glass powder and/or silicon powder may also be present.
