A packaging device for a sheet-like glass article is comprised of fastened front and rear panels which define an envelope-type receptacle. The front panel is provided with locking tabs that cooperate with corresponding slots in the upper portion of the rear panel, the upper portion of the rear panel being folded over the top edge of the front panel but behind the locking tabs thereof when in use.
A glass sheet, and a shipping case for the sheet are disclosed. The shipping case comprises two paperboard sheets with central portions which are substantially coextensive with and on opposite sides of the major surfaces of the sheet, and pairs of opposed, substantially coextensive flaps which surround the central portions. An adhesive prevents movement of the opposed flaps relative to one another and of the sheet within the case. In a preferred embodiment the flaps of one of the pairs are integral with one another and are disposed on opposite sides of a fold line. In another preferred embodiment, the shipping case additionally includes at least one flap which is structurally integral with one of the paperboard sheets along an edge thereof, and is folded around a peripheral edge of the article and adhered to the exterior surface of the central portion of the other sheet.
A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner container adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed container arrangement preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers prevent shocks applied to the outer container from damaging the wafers.
A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner container adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed container arrangement preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers prevent shocks applied to the outer container from damaging the wafers.
