A resin composition useful in hair dressing preparations which comprises the resin-containing liquid obtained by refluxing the following copolymerizable monomeric ingredients under copolymerizing conditions in a water-soluble organic solvent; (1) 5-89 percent by weight of a diacetone acrylamide, (2) 5-40 percent by weight of at least one ester of an alkanol having 4-18 carbon atoms and an acid selected from a group consisting of acrylic acid and methacrylic acid, (3) 6-35 percent by weight of at least one acid selected from a group consisting of acrylic acid, methacrylic acid and itaconic acid, (4) 0-84 percent by weight of at least one ester of an alkanol having one to three carbon atoms and an acid selected from a group consisting of acrylic acid and methacrylic acid.
A process for emulsion-polymerizing unsaturated monomer(s) is disclosed. When a hydrazine derivative having at least two hydrazine residues per molecule is added to the polymer dispersion obtained by said emulsion polymerization process, a polymer dispersion composition capable of forming a film which is excellent in blocking resistance, adhesiveness to an alkyd resin film, water-resistant adhesiveness to an alkyd resin film and water-resistant anti-whitening can be obtained.
A process for the manufacture of copolymers by copolymerizing acrylic acid or methacrylic acid with esters of acrylic acid and methacrylic acid in the presence of polymerization initiators, in which methyl methacrylate, acrylic acid and/or methacrylic acid and a higher alkyl acrylate are copolymerized.
