Compositions of universal adhesion are provided comprising (I) petroleum wax reinforced with ethylene/olefin copolymer reinforcing resin and (II) an adhesion promoting system consisting essentially of (a) a polar polymeric additive such as copolymers of ethylene with vinyl esters, acrylates and unsaturated carboxylic acids or acid derivatives and (b) a tackifying resin such as wood rosin or its derivatives.
A polymer composition is disclosed and consists essentially of 100 parts by weight of an ethylene-alkyl acrylate copolymer and about 1 to 15 parts by weight of an ester formed from a rosin acid and ethylene glycol, propylene glycol, or glycerine. The polymer compositions have a lower heat sealing temperature than the ethylene-alkyl acrylate copolymer contained therein.
A process for substantially eliminating surface melt fracture during extrusion of a thermoplastic polymer such as a molten narrow molecular weight distribution, linear, ethylene copolymer, by incorporating into the thermoplastic polymer a wood rosin or wood rosin derivative.
A novel heat release layer for use in connection with decalcomanias which include a vitreous design layer surrounded by a heat release layer and a heat activatable adhesive layer is disclosed. In particular, the novel heat release layer disclosed comprises a normally solid straight chain, primary aliphatic oxyalkylated alcohol which preferably has a molecular weight above about 1350.In addition, methods of preparing such heat release decalcomanias are also disclosed, including applying a heat release layer to a backing sheet, applying a design layer to the heat release layer, and applying a heat activatable adhesive layer to the design layer, again wherein the heat release layer is as described above. A novel combination of heat release layers and heat activatable adhesive layers is also disclosed, including the heat release layer described above in combination with a heat activatable adhesive layer including an acrylic resin and a tackifier for the acrylic resin including a polyethylene glycol and/or a solid polyoxyalkylene derivative of propylene glycol or ethylene diamine, and including an organic solvent therein, as well as the combination of the heat release layer with a heat activatable adhesive layer including a straight chain, primary aliphatic oxyalkylated alcohol, a cellulosic derivative, a plasticizer and an organic solvent.
A composition for the manufacture of hot-melt adhesives, in which the improvement comprises a terpolymer of ethylene having a melt index between 5 and 500 dg/minute and comprising from 1 to 10 mol % of units derived from an ester selected from alkyl acrylates and methacrylates, the alkyl group having from 1 to 6 carbon atoms, and from 0.3 to 3 mol % of units derived from maleic anhydride. The composition also contains at least one tackifying resin and may contain at least one compound selected from paraffin, microcrystalline polymeric wax, and esters of a hydrogenated rosinic acid and of a lower alcohol.
Hot melt adhesives with long open time and good cold metal bonding are made of blends of an at least partially crystalline copolymer of butene-1 and ethylene, an aliphatic, substantially non-polar resin, an antioxidizing agent and, optionally, microcrystalline wax.
