A porous, cured unsaturated polyester resin bonded grinding tool having very fine pores uniformly dispersed therein is produced by molding a homogeneous mixture comprising abrasive grains, a water-in-oil emulsion of an uncured unsaturated polyester resin and a curing catalyst to form a mold of the intended grinding stone shape, curing the unsaturated polyester resin contained in the mold, and drying the mold to remove the water therefrom.
Effective cleaning of an article can be achieved by a method comprising scrubbing the surface of the article by means of a cleaning roll having a surface layer of polyvinyl acetal porous elastic material having a porosity of 85% to 95%, an average pore opening of 10 to 200 .mu.m, and a 30% compression stress in the state characterized by a water content of 100% based, on the dry weight of the material, of 15 to 150 g/cm.sup.2.
A foamed abrasive element comprises a bond of a crosslinked and hardened unsaturated polyester resin and abrasive grains dispersed in the bond and having a porosity of 10 to 80% and a compressive modulus of 10.sup.2 to 10.sup.5 kg/cm.sup.2. A method of foamed abrasive element is also disclosed.
An abrader for use in mirror polishing of glass comprises a porous cured unsaturated polyester resin and zirconium oxide or cerium oxide or red iron oxide. Desired mirror polishing of glass is effected by grinding the glass surface with this abrader under continued supply of water or a cutting oil to the interface of grinding.
The present invention relates to a method for polishing a silicon wafer. The method comprises the steps of: (a) supplying a polishing fluid to a polishing surface, the polishing fluid including an alkaline fluid and polishing particles of high-purity silica dispersed in the alkaline fluid, the polishing surface being planar; (b) bringing a silicon wafer in contact with the polishing surface; and (c) moving at least one of the silicon wafer and the polishing surface relative to the other, thereby polishing the silicon wafer. The method is characterized by the following: the polishing surface is made of a ceramic material harder than the silicon wafer and more resistant to mechanochemical polishing than silicon, and the maximum roughness of the ceramic is less than 0.02 .mu.m.
A method of producing an abrasive tape by preparing an abrasive paint containing abrasive grains having a grain size of 0.05 to 10 .mu.m and containing air bubbles which, upon coating of a flexible substrate, form an abrasive layer having pores in content of 10 to 60% by volume based on a volume of said abrasive layer.
