A method and apparatus for non-destructive testing of beam-lead integrated ircuit connections in which each of the leads from a chip beam-lead device has a pull tab made interval therewith with a weakened area and means for connecting a pull tool thereto to test the bond strength between the individual lead and the conductor to which the lead is bonded to determine if a predetermined bond exist between the lead and the conductor.

A method of detecting engagement/disengagement characteristics of a less-force required type mating connector, and apparatus therefor. In the less-force required type mating connector, a lever provided in a first connector is pivoted to engage or disengage a second connector with or from the first connector. The first connector is pivoted about a center of pivotal movement of the lever while the pivotal movement of the lever is prevented. A load required to prevent the pivotal movement of the lever is detected. Since the lever is unchanged in its position and angle, the load acting in one direction alone may be detected. Hence, the engagement/disengagement characteristics can be accurately detected.

A method for destructive testing of the bond strength of each individual d of a chip beam-lead device which includes cutting the chip using a laser, laser cutting a hole through each individual piece of the chip with the lead attached to the chip and inserting a hook of a pull tester into the hole made in each chip section and pulling the chip section and the lead attached thereto to determine the bond strength between the lead of the chip and the conductor to which the lead is attached.

A method for measuring the bonding power of an adhesive material, particuly a sheet material comprising fibres impregnated with a glue. After having applied against the material the face of a totally reflecting prism the index of refraction of which is lower than that of the glue, a force is exerted which tends to bring apart from each other the prism and said material, the value of the force corresponding to the separation is determined and the quotient is made of said force by the value of the contact area measured at the moment of the separation from the light totally reflected by said face.

A method includes applying a fluid force to a lead and determining if a lead separates at its bond in response to fluid force. The fluid can be applied to all the leads simultaneously or to given groups of leads. The determination of how many and which leads are separated is produced by positioning a sensor adjacent the leads and an indicator.