A distributed resistance-capacitance component formed of windings of dielectric films having patterns of metallized layers formed thereon with margins shaped to provide a distributed resistance along the metallized layers and capacitance between the metallized layers on opposite sides of the dielectric films. Electrodes and leads are secured at opposite ends of the wound coil by metal spraying or schooping.
The present invention is directed to an AC termination which includes a substrate having first and second surfaces. A resistor is mounted on the first surface of the substrate. An input termination is at one end of the resistor. At least one plate of a capacitor is on the substrate and is electrically connected in series with the other end of the resistor. In one form of the termination, the capacitor is a metal film on the substrate extending from the other end of the resistor to and across the second surface of the substrate to form one electrode of the capacitor. A dielectric layer is over the metal film and another metal film extends over the dielectric layer to form the other electrode of the capacitor and the output termination of the termination. In another form of the termination, the capacitor is formed on a cover plate which extends over the first surface of the substrate and is electrically connected between the resistor and an output termination. In still another form of the termination, the substrate is of a conductive metal and forms one electrode of the capacitor, and a layer of a dielectric material extends over the second surface of the substrate.
A coil element with no solder joints is made of a continuous conductive strip includes a first terminal, a second terminal, a conductive path between the first terminal and the second terminal. The conductive path has curved regions and foldable hinge regions shaped such that the coil element may be folded into single or multi-turn coils for use in transformers and other electronic devices.
