Apparatus for handling delicate workpieces such as semiconductor substrates which have the configuration of small plates. The workpieces are preliminarily situated at predetermined locations in a positioning plane. Then, without changing their positions relative to each other, the workpieces are all simultaneously transferred away from the positioning plane while being maintained during transfer in a common plane which moves with the workpieces. During their transfer the workpieces are held by suction in this common plane by way of suitable suction nozzles which have at least at their ends which engage the workpieces a soft elastic material. This common plane in which the workpieces are situated during their transfer is brought into coincidence with a predetermined working plane at which the workpieces are deposited upon termination of the suction at the nozzles and application of a pressure greater than atmospheric pressure at the nozzles, and in the working plane the workpieces are situated at locations which have with respect to each other the same relationship as the locations of the workpieces at the positioning plane. All of the above planes are preferably horizontal and of course parallel to each other at all times.
A method for the automatic, correctly positioned transfer and clamping of workpieces, especially rotationally-symmetrical, thin-walled workpieces, which are imparted on interdependent finishing or processing on both sides thereof in a machining work station, in which the workpiece is retained through the intermediary of vacuum-operated clamping units, and which are maintained in a transferring and receiving work station through main spindles coaxially facing towards each other. Furthermore, also provided is an arrangement for implementing the above-mentioned inventive method for the automatic, correctly positioned transfer and clamping of workpieces, especially, rotationally-symmetrical, thin-walled workpieces.
A method of automatically chamfering a wafer and an apparatus therefor are disclosed. The method comprises the steps of supplying a wafer, positioning and setting the wafer on working stages, chamfer-machining the wafer on the working stages, and recovering the wafer, all the steps being continuously performed on a full-automatic basis. The apparatus comprises a wafer supply means, a wafer positioning and setting means, a chamfer-machining means for the wafer, a wafer recovering means, and a wafer transferring means. Since the method and apparatus therefor enables performance of a series of those operations on a continuous and full-automatic basis, it is possible to enhance the operating efficiency and machining ability and, at the same time, to achieve manpower reduction.
An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collection assembly. The primary mobile member is movable toward and away from the crystal rod, and the secondary mobile member is mounted on the primary mobile member and is movable relative to the primary mobile member in a direction toward and away from the semiconductor crystal rod. The wafer collecting assembly is mounted on the second mobile member for collecting the wafers sliced from the semiconductor crystal rod.
This disclosure relates to an object transport apparatus particularly useful for the high speed handling of semiconductor chips. Transport is achieved by driving a vacuum pickup, through a rotational motion toward an object resting at a first reference location while simultaneously driving a cam, restraining a spring loaded cam follower, so that the vacuum pickup is positioned proximal to the first reference position. Vacuum is applied to secure the object to the pickup. The cam and shaft are then simultaneously driven in the opposite direction to clear the other objects and obstruction by swinging the object through an arcuate motion while simultaneously elevating the object. As the pickup and object continue through the arcuate motion, the cam motion is reversed to position the object proximal to a deposition surface located at a second reference position. The cam is then further driven to contact the object with the deposition surface, the vacuum is released and the object is released. The cam is then driven down to allow the pickup to avoid interference with the released object or other obstructions and both the cam drive and shaft drive return the pickup to an index position, readying the apparatus for another cycle. All motions and operations are controlled by a controller.
An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collecting assembly. The primary mobile member is movable toward and away the crystal rod, and the secondary mobile member is mounted on the primary mobile means and is movable relative to the primary mobile member in a direction toward and away from the semiconductor crystal rod. The wafer collecting assembly is mounted on the second mobile member for collecting the wafers sliced from the semiconductor crystal rod.
