A heat curable coating medium for use in the formation of a cured, highly cross-linked, polymeric coating on a substrate. The coating medium comprises an aromatic diamide diacid diamine formed as the reaction product of an aromatic diamine and an aromatic dianhydride, in the molar ratio of two-to-one respectively, in a solvent.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a division of copending application Ser. No. 475,483 filed June 3, 1974, now U.S. Pat. No. 4,003,947 which is a continuation-in-part of copending application Ser. No. 467,615 filed May 6, 1974 which is, in turn, a continuation of application Ser. No. 822,899 filed May 8, 1969, now abandoned, and the contents of such copending and abandoned applications are specifically incorporated by reference herein.
A process for forming heat resistant resin films comprising the steps of admixing a polyimide resin precursor solution, for example, a solution containing a reactant obtained from pyrromellitic dianhydride, 3,3',4,4'-benzophenyltetracarboxylic acid dianhydride, 4,4'-diaminodiphenyl ether, and 4,4'-diaminodiphenyl ether-3-carbonic amide with an organosilicic compound solution, coating a silicon substrate with the resulting admixture, and subjecting said coated silicon substrate to heat treatment.
Free-flowing, stable dispersions of crosslinked rubbers in the form of discrete particles having an average diameter of 0.1 to 3 .mu.m in organic liquids, containing I) up to 60% by weight (based on the dispersion as a whole) of a crosslinked, rubber-like, particulate graft polymer of a) a crosslinked silicone rubber as core and crosslinked acrylate rubber b) graft polymerized thereon as the rubber and II) a liquid, organic N,N-substituted amide as the continuous organic phase, and a process for their production.
This invention relates to a process for producing bis-[aminophenyl ketones] and the resulting compositions which are suitable for the preparation of engineering polymers, e.g., polyimides, polyurethanes and a host of other resinous materials. The bis-[aminophenyl ketones] are formed by reacting 2 moles of a nitrophenyl acid halide with an aromatic bridging composition having at least two hydrogen atoms of sufficient reactivity to undergo acylation reactions whereby nitrophenyl ketone groups are attached to the aromatic bridging group. The resulting bis-[nitrophenyl ketones] then are converted to the amine by hydrogenation or by double nucleophilic displacement with an aminophenol. The invention also relates to polyimides and polyamides prepared from such bis-[aminophenyl ketones].
A method is disclosed for substantially reducing shrink back of thermosetting materials from electrical cable. The method comprises reheating the cable, after curing of the thermosetting material and cooling of the cable, to a temperature below the melting point of the thermosetting material.
Aromatic amines and their alkyl, amide, imide or amide-imide substituted derivatives in the presence of catalytic quantities of phenols, cresols, xylenols, bisphenols, and their like cause epoxide resins to thermoset at ambient temperatures. The resulting crosslinked polymers are useful for two component solution systems which provide corrosion and temperature resistant clear coatings or paints, and can also be used as solventless, liquid, two component systems for casting clear, pigmented or filled parts.
