A vibrator unit for use in a timepiece comprises a vibrator mounted within a ceramic case. A glass lid is airtightly sealed to the ceramic case by means of a soldering washer soldered between opposing surface portions of the lid and case. The soldering washer consists essentially of 90Sn-10Au solder alloy which enables formation of the airtight seal at lower and/or shorter soldering temperatures than would be the case with conventional solder alloys thereby avoiding an increase in the equivalent impedance of the vibrator unit which would otherwise occur. As the equivalent impedance can be maintained at a low value, the vibrator unit can therefore be made smaller without adversely affecting the equivalent impedance which is maintained below 350 K.OMEGA..
A flatpack package for hermetic encapsulation of piezoelectronic components, which flatpack is suitable for use in efficient and automated surface mounting (SMT). The flatpack package consists of a base plate, a cover plate and a mounting unit of two support frames between which are placed lamellar connecting leads leading into the package. The leads serve both for mechanical holding of the quartz resonator disk and as the electrical connection thereof. All the package parts are produced from glass, are connected to one another by using solder glass as a sealing material. The parts are dilathermally matched with one another.
A piezoelectric oscillator is described comprising a piezoelectric element, e.g. a tuning fork (10), and a casing (20) formed by a pair of glass plates (22,24). The inner surfaces of the plates have recesses (26,27) that define a housing (28) in which the tuning fork (10) is located, and a pedestal (22a) to which the tuning fork (10) is secured. The inner surface of one of the plates (22) carries a conductive track (30), in the region of the pedestal (22a). This plate (22) is also formed with a hole (44) opening onto the conductive track (30) which seals it off.
The invention relates to an encapsulated piezoelectric resonator device comprising an oscillating member having a quartz member and a frame integral with and surrounding the quartz member, the frame having two connecting faces, electrodes on the quartz member, and two cover members, each having a central depression defining a frame provided with a connecting face, each connecting face of the oscillating member being bonded with the connecting face of the cover member for sandwiching the oscillating member between the cover members. The invention also relates to a method for manufacturing such an encapsulated piezoelectric resonator device comprising the steps of machining a quartz plate by photolithography for making at least one oscillating member, forming electrodes on the quartz member, making at least two cover members having central depressions defining their peripheral frames and bonding the oscillating member with two cover members by their frames.
A ceramic package includes a ceramic case for installing a piezo-vibrator therein. Capacitors are formed directly on the bottom surface of the ceramic case through the multi-layer printing method. Electrodes of the capacitors also function as input and output electrodes for the piezo-vibrator.
An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.
