Tooling connected to the punch pad and die pad bolsters of a progressive die operable as the contacts are being punched out to hug or impact opposite side edges of a contact and thereby form mounting and/or electrical energy transfer surfaces on the side edges. The tooling makes contacts having mounting sections with mounting surfaces which provide for improved mounting characteristics and which also may function as electrical energy transfer surfaces. The tooling makes contacts having retention sections, the retention sections having a pair of outboard arms and an inboard arm and which, when the retention section is inserted in a circuit board aperture, will be engaged by the outboard arms and function to prevent the metal of the outboard arms from being strained beyond the elastic limit and the outboard arms having surfaces formed by the tooling. The tooling makes contacts having electrical energy transfer surfaces which are continuous to thereby greatly improve reliability and reduce interconnection forces.

A method and apparatus are provided for coining solder balls on an organic electrical circuit package. Generally, this method includes placing a slug on one or more of the solder balls; and applying sufficient pressure for a sufficient period of time on the slug to flatten the surface of the solder balls so as to form planar solder coins. The apparatus includes a press; a ram attached to the press; a platform for receiving the package and a slug placed upon the solder balls.