A surface mountable integrated circuit chip package is taught. Briefly stated, a flexible laminate having conductive strips thereon is wrapped around a heat sink. Plastic is molded around the laminate-heat sink piece, with a window left in the center thereof, which coincides with a window in the laminate. An integrated circuit chip is then bonded to the heat sink with wire leads then run from the chip to the conductive strips on the laminate. A potting material is then placed in the window thereby completely encapsulating the integrated circuit chip so as to prevent exposure to environmental or physical damage. This thereby forms a package which is surface mountable to a circuit board through attachment techniques such as the vapor phase soldering.

A separable assembly for connecting and mounting an integrated circuit chip (10) to a chip carrier substrate (12) utilizing the principle of field emitter current induction. Transmitting zones (14, 26, 28) on the chip (10) and substrate (12) are formed as recessed arrays of field emitter projections (30, 32) and the respective receiving zones (24, 16, 18) are planar conductive films. The chip (10) and the substrate (12) are separably connected with the respective transmitting and receiving zones in alignment with each other.

A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.

A multi-chip, self-aligning, integrated circuit flip-chip assembly using flexible connection assemblies for its attachment is enclosed in an integrated circuit package. The connection assembly contains connection pillars which are attached to a die and a carrier wafer by means of flexible membranes covering cavities in the respective components. Each pillar consists of two opposing connection posts, of die and carrier wafer, joined by a solder bump. A post is formed by etching a ring into the dielectric around predefined metal islands provided by the process, which are interconnected by respective vias to form a conductive core. The conductive path established between first layer metal interconnects of mating components via the connection pillars furnishes the electrical interface between chip and carrier in the flip chip arrangement. Flexure of the membranes allowed by the air filled cavities enables the connection pillars to tilt, so as to relieve the assembly of shear strain when subjected to differential thermal expansion. A membrane prober, using test metal bumps in place of solder joints but which is otherwise identical to the flip-chip assembly, can be interfaced with a tester to perform conventional vector testing of individual chips or complete multi-chip assemblies. Alternatively, test assemblies with metal bumps can be configured as "system-emulators" for testing individual production chips, by providing a test environment that accurately represents the full system. This test method dispenses with the many technical drawbacks and high costs associated with conventional vector testing, including the loading by the low tester impedance.

A multiple chip module (MCM) is fabricated by connecting a series of semiconductor chips, in a flip-chip orientation, to a multi-chip substrate with resilient connection pads. The substrate is formed from silicon by placing a layer of SiO2 on the surface. At the locations requiring a resilient connection pad, the SiO2 layer is pierced with a series of closely spaced holes. A cavity is etched out of the silicon below the closely spaced holes. The SiO2 layer is now suspended over the cavity and forms a flexible membrane. A post is formed on top of the flexible membrane. A conductor formed on the substrate has one end supported by the post. One end of the conductor is, therefor, supported by the post and flexible membrane so that a solder bump placed thereon may be used for a demountable connection to a contact pad on a flip-chip.