The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.
RELATED APPLICATIONS
This is a continuation-in-part application of U.S. application, Ser. No. 971,629, filed Dec. 20, 1978, now abandoned, which is a continuation of U.S. application, Ser. No. 851,338, filed Nov. 14, 1977, now abandoned.
A socket (10) for use with leadless chip carriers has been disclosed. The socket (10) includes contact elements (16) positioned in cavities (34) in a housing (12) and having a first spring arm (100) extending into a central opening (30) for engaging pads on the chip carrier and a second spring arm (102) extending outwardly of the housing (12) for electrical engagement with circuits on a substrate on which the socket (10) is mounted.
Surface mount connector has terminals which float axially in passages through housing. Each terminal is spring loaded toward mounting face to provide compliance between solder tails and pads on printed circuit board. Metal clips have legs received in holes through board which anchor connector independently of solder tails.
A land grid array connector is electrically connected between a first electrical device and a second electrical device. The land grid array connector comprises an insulative rectangular housing defining a plurality of passageways therein for respectively receiving a resilient contact therein which has a first end electrically contacting with the first electrical device and a second end electrically contacting with the second electrical device. The insulative housing has a body portion and four raised sides extending upward from the body portion, thereby defining a central cavity between the four raised sides for receiving the first electrical device. A first resilient arm and a second resilient arm are formed in respective adjacent raised sides for fittingly engaging the first electrical device in the central cavity.
The invention discloses an electrical connector for interconnecting electronic packages to printed circuit boards. The connector includes clamps which, in cooperation with the circuit board, secure the connector thereto and place the interconnecting members in compression between the package and board.
A connector assembly for an integrated circuit package comprises a rectangular housing having an IC package receiving face and having contacts therein which engage and contact terminal pads on a substrate positioned on the IC receiving face. A clamping lid is hinged to the housing and serves to clamp the substrate against the contact terminals in the housing to ensure good electrical contact. An improved latching means is disclosed for retaining the clamping lid in its closed position.
