A projection extending substantially perpendicularly from an arm or lever of a zero insertion force (ZIF) socket serves as a retention member for a component assembly in the ZIF socket. The ZIF socket comprises: a body having a plurality of electrical contact apertures for receiving a plurality of component assembly pins from a component assembly placed over the body; a binding member located below and slidably coupled to the body allowing insertion in and extraction of the pins from the plurality of electrical contact apertures of the body when the binding member is in a first position relative to the body, and retaining the plurality of component assembly pins when the binding member is in a second position relative to the body; and a first arm member rotatably coupled to the binding member for positioning the binding member relative to the body. The retention member comprises a first projection extending substantially perpendicularly from the first arm and extending over a portion of the electronic component to provide a retention force toward the body.

An arrangement for mounting a chip (14) to a printed circuit board (10), wherein a lock nut (18) is cemented to the chip carrier to extend through an aperture (28) in a socket moulding (26) and into an aperture (30) in the pcb, the latter also receiving from the opposite direction a mounting screw (36) which screws into the lock nut to clamp the assembly together, with interface contacts (16) on the chip carrier connected to contact pads (12) on the pcb by interconnecting elements principally accommodated in slots (38) in the socket moulding.

a cover assembly for a leadless chip carrier socket including a spring cover and locking bracket selectively positionable on a socket body in any one of four positions. The spring cover is pivotally mounted on the socket body and is movable between an open position and a closed position at which the cover engages the locking bracket. The cover is formed with four arm members which are spring loaded and which engage the top of a chip carrier at eight pressure points. The force exerted by the spring cover in a closed position applies a downward force against the chip package to effect positive electrical contact with a plurality of contacts mounted in the socket which are adapted to be interconnected with a printed circuit board or circuit pad.

A connector mounting for an integrated circuit chip package having pad-type terminal contacts around its periphery, has a flat synthetic resin housing provided with a recess in its top side for receiving the chip package with its terminal contacts facing downwardly for electrical contact with laterally extending flexible spring contact arm portions of respective contact members mounted in the housing. An electrically conductive metal clamp or cover member is hingedly mounted on the housing to engage and press the chip package downwardly in the housing recess into contact member-engaging position therein. The contact members have rigid contact pin portions firmly anchored in the housing bottom and projecting perpendicularly downward therefrom in row alignment around the housing for plugging into a printed circuit board. The metal clamp member engages and presses down against ground contact means on the chip package to electrically connect and ground the chip package to a metal ground shield which encases the housing and with which the clamp member is engaged.

A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures which extend through the retainer so that the elements are radially compressed. The retainer is disposed between the active integrated circuit and the passive substrate. The retainer may be secured either mechanically or through bonding agents to the active integrating circuit and the passive substrate. Axial compression of the resilient elements upon disposing the retainer between the active integrated circuit and the passive substrate provides for wiping action of the resilient elements on the contacts of the active integrated circuit and the passive substrate. The contact retainer may include thermal paths for heat dissipation of the integrated circuits to accommodate a higher density of integrated circuits.