A chip-shaped piezoelectric vibration part provided integrally with capacitors and resistances, which is so constructed that a piezoelectric element including a pair of vibrating electrodes is housed in a tubular casing whose openings at both axial ends are covered by respective caps, both vibrating electrodes being connected with the caps corresponding thereto through conductive connecting materials, the tubular casing being provided with either one or both of the capacitor and resistance, so that the part is small-sized as a whole to enable its integration degree for package to be improved and is easy to handle.

If a piezoelectric crystal is used in circuits containing ICs with low supply voltage, the additional capacitors required in oscillator or filter circuits cannot be implemented as junction capacitances. To eliminate the need for additional discrete capacitors, these capacitances are implemented with additional films on the crystal.

A packaged piezoelectric oscillator is provided which comprises an insulating package body, a piezoelectric element, and a lid member. The package body has an upwardly open housing groove which has a bottom surface formed with oscillator electrodes at both ends of the housing groove. The package body is externally formed with first to third electrodes spaced from each other. The first and second electrodes extend into the housing groove for electrical connection to the respective oscillator electrodes, whereas the third electrode is located between the first and second electrodes. The piezoelectric element is fixedly received in the housing groove of the insulating package body and held in electrical conduction with the respective oscillator electrodes. The lid member is attached to the package body to close the housing groove. The lid member has a lower surface formed with first to third capacitor electrodes in electrical conduction with the first to third lead electrodes, respectively.

A piezoelectric resonator with a rectangular parallelepiped resonator. A lithium niobate single crystal is used as the resonator chip material. Each of the opposed main surfaces of the resonator chip is arranged to be a surface of a rotated Y-cut plate which is rotated 165.+-.5 degrees about an X-axis. The angle of the longitudinal direction of the resonator chip is arranged to be 90.+-.5 degrees with respect to the X-axis of the rotated Y-cut plate.

An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.