A skin package wherein an article is enclosed between layers of thermoplastic film joined by heat sealing around the perimeter of the article and including at one side a strip, enclosed between the layers and projecting from them, which is heat sealed to one layer only and is non-adherent or only lightly adherent to the other layer.
Method and apparatus for handling semiconductor chips and the like are disclosed which include the use of a flat flexible film which is attached to the face of a base member. The face of the base member is formed with recesses covered by the flat flexible film. Chips are loaded onto the flat flexible film in good surface contact therewith whereby they are securely held in position by interfacial, adhesive, or other forces between the chips and film. To facilitate removal of chips from the film, the recesses are connected to a vaccuum source, drawing portions of the flexible film into said recesses and providing the film with a texturized, or undulating, surface. The area of contact between the chips and film is thereby reduced which, in turn, results in a reduction in the force by which the chips are attached to the film, thereby enabling removal of the chips by conventional techniques.
Method for handling semiconductor chips and the like objects are disclosed which include the use of a flat flexible film that is supported on a flat porous texturized fabric sheet such as a woven or knit fabric having spaced fiber crossovers. Objects, are supported on the flat flexible film in intimate surface contact therewith for securely holding the same in position by interfacial forces therebetween. Adhesive may be included for increasing the interfacial force. To facilitate removal of objects from the film, the fabric is connected to a vacuum source for drawing portions of the flexible film over and between crossovers in the fabric whereby portions of the flexible sheet are withdrawn from the objects. The contact area and interfacial forces between the flexible sheet and objects is thereby reduced to enable removal of the objects from the sheet using conventional object handling techniques.
Apparatus for handling semiconductor chips and the like objects are disclosed which include the use of a flat flexible film that is supported on a flat porous texturized fabric sheet such as a woven or knit fabric having spaced fiber crossovers. Objects, are supported on the flat flexible film in intimate surface contact therewith for securely holding the same in position by interfacial forces therebetween. Adhesive may be included for increasing the interfacial force. To facilitate removal of objects from the film, the fabric is connected to a vacuum source for drawing portions of the flexible film over and between crossovers in the fabric whereby portions of the flexible sheet are withdrawn from the objects. The contact area and interfacial forces between the flexible sheet and objects is thereby reduced to enable removal of the objects from the sheet using conventional object handling techniques.
A composite film and vacuum skin package for packaging a product such as a fresh red meat is disclosed. The composite film is thermoformed and sealed under vacuum to a support member to completely enclose a product which is positioned on the support member. The composite film is a permeable film weakly bonded to an impermeable film, permitting the impermeable film to be peeled from the package while leaving the permeable film intact so that the fresh red meat product can bloom from a purplish color to a desirable red color upon exposure to oxygen. The permeable and impermeable films are fully peelable without the need for a migratable wax to enhance peelability.
A package for carrying fluid or powder samples and which is well adapted for application to product packaging or cards using automated equipment. The package may be produced using a support web, a web of double coated tape, or a web of transfer tape.
