Spring 52 mounts on cold plate 12 to urge thermal conductive layers 82 against flange 20 on cold plate 12. Spring has a plurality of pressure flanges, one corresponding to each cold plate flange so that a unitary spring structure can be quickly assembled on the cold plate. Thermal interconnection is expected to be used on all standard and improved standard electronic modules. It is being designed into ANSQS-53.
An interconnection system, both electrical and thermal, allowing improved evacuation of the thermal dissipation of printed-circuit boards. It comprises zero insertion force electrical and thermal connectors such as (67) and (69) of the plug-in type, which are applied by their metallic bases to one of the metallic layers of the mother boards (60) and (61), and other connectors of the same type, such as (68) and (70), which are applied by their bases to the other external layer of these mother boards (60) and (61). The mother boards are inclined, sloping downwards from the front panel or door (63) to the rear part (64) of a cabinet. Application: racks and cabinets for electrical and telecommunication equipment.
The present invention relates to a thermal connector for printed circuit card mounted with at least one electronic component, the card having a heat-conducting substrate. The connector has at least one wall made of a material which is a good heat conductor in direct contact with a part of the heat-conducting substrate and a means forming a heat sink integral with the wall. The invention applies in particular to electronic cabinets comprising a large number of cards.
A finned heat sink is constructed from a base having parallel grooves with a latching lip. The fins are individually formed with a retaining boss adjacent one edge which is adapted to mate with the latching lip to secure the fin in the groove. Spacing tabs are formed on the fins to assure uniform parallel spacing between the fins when assembled.
A card guide which optimizes the flow of forced cooling air, provides for self alignment to a host motherboard and provides for integrated ESD hazard mitigation, includes an elongated body having a groove disposed along a longitudinal axis of the body. The groove is adapted for receiving the edge of an inserted daughter card. The card guide further includes integral, arcuate inner and outer deflectors, which form a channel for redirecting incident air flow toward regions of the daughter card which would otherwise be blocked from the air flow. The end of the card guide that receives the daughter card houses an ESD clip. The ESD clip functions to dissipate static charge accumulated on the daughter card from a conductive strip disposed along the edge of the daughter card. The ESD clip further serves to dissipate accumulated static charge from a front panel attached to the daughter card, via a guide pin fixedly attached to the front panel. The end of the card guide proximate to the motherboard includes an alignment pin, which engages a corresponding aperture in the motherboard to properly register the card guide to the associated connector on the motherboard.
A heat exchanger and method for mounting and cooling electronic components includes a chassis with plural removable mounting modules and a coolant distributor mounted on the modules. Each of the modules has a thermally conductive core for mounting electronic components and heat transfer ducts integral therewith that form uninterrupted thermal paths for conduction of heat from the electronic components to the coolant in the ducts. Each module has it own coolant ducts so that the weight of the heat exchanger may be reduced by the weight of the ducts when a module is removed, and so that cooling for each module may be separately tailored.
