In the present invention, a length of elongated single crystal ingot is mounted adjacent its ends and is ground while being rotated to provide a cylindrical shape. While still mounted, the crystal is rotated into a position to be x-rayed for the grinding of a flat thereon with the crystal in a non-rotated state.
A method of manufacturing wafers of semiconductor material incorporates the steps of: providing an elongated ingot of semiconductor material having a curved surface along the direction of elongation; mounting a structure for ingot mounting on each of the end surfaces of the ingot; positioning the ingot mounting structures on fixture structures to mount the ingot; and rotating the mounted ingot. The positioned ingot mounting structures are released and the ingot is removed from the fixture structures; however, during the course of the process the mounting structures are again positioned on fixture structures to mount the ingot and the ingot is rotated a second time. The method is adapted for accurate centering of the ingot during processing involving the sawing of the ingot to provide opposed elongated planes therealong (including rotation of the ingot in accomplishing such) and involving further rotation of the ingot during grinding. The ingot mounting structures are centered on the basis of crystallographic node lines that appear on the grown ingot. The mounting structures have spherical surface portions for accuracy in centering the ingot in fixtures having conical surface portions to abut the spherical surfaces in mounting the ingot.
An exemplary method for grinding workpieces is provided. Firstly, a plurality of workpieces (18) are bonded together. The bonded workpieces have a central axis (181). Secondly, a grinding wheel (10) is provided. The grinding wheel has a rotating axis (100), and the rotating axis is perpendicular to the central axis. Thirdly, the bonded workpieces are rotated around the central axis. Fourthly, the grinding wheel is placed near to the bonded workpieces, and the rotating axis and the central axis are separated by a predetermined perpendicular distance. Finally, the grinding wheel is rotationally moved along the central axis to grind the workpieces whilst maintaining the predetermined distance between the rotating axis and the central axis.
An apparatus for manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw. The apparatus includes a measuring device for measuring the crystal orientation of the ingot; an adhering device for adhering a support to the surface of the ingot based on the orientation where the support includes an intermediate plate and a support plate, where the support plate is adapted to fit the wire saw, and where the adhering device includes an auxiliary adhering element for adhering the intermediate plate to the surface of the ingot and an adhering element for adhering the support plate to the intermediate plate; a dryer for drying and solidifying an adhesive applied between the ingot and the intermediate plate and an adhesive applied between the intermediate plate and the support plate; and the wire saw for slicing the ingot into the plurality of wafers while the ingot is supported on the support. The apparatus may include stockers for storing the ingot and transferring devices for transferring the ingot within the apparatus.
A method for connecting a cylindrical ingot to a support plate includes measuring a crystal orientation of the ingot based on a diffraction of x-rays, rotating the ingot about a center axis based on the crystal orientation so that a center axis of the ingot is held parallel to a first plane and an orientation axis based on the crystal orientation is placed in a plane parallel to the first plane, adhering an intermediate plate to the ingot, adjusting a position of one of the support plate and the ingot in a plane parallel to the first plane based on the crystal orientation so that a mounting axis of the support plate is in a specific relationship with the orientation axis, and attaching the support plate to the intermediate plate.
An apparatus for connecting a cylindrical ingot to a support plate includes means for measuring a crystal orientation of the ingot based on a diffraction of x-rays, means for rotating the ingot about a center axis based on the crystal orientation so that a center axis of the ingot is held parallel to a first plane and an orientation axis based on the crystal orientation is placed in a plane parallel to the first plane, means for adhering an intermediate plate to the ingot, means for adjusting a position of one of the support plate and the ingot in a plane parallel to the first plane based on the crystal orientation so that a mounting axis of the support plate is in a specific relationship with the orientation axis, and means for attaching the support plate to the intermediate plate.
