The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.
Certain continuous methods for monitoring the quality of ZnSO.sub.4 electrolyte lose sensitivity when the electrolyte contains Sb (V). The sensitivity can be increased by electrochemically reducing Sb (V). A sample of electrolyte which contains impurities including Sb (V) and which may also contain polarization affecting agents is passed through a test cell containing an elongated moving cathode having a predetermined area exposed to the electrolyte, an anode and a reference electrode. A substantially constant current in the range of 0.01 to 0.20 A/cm.sup.2 is applied to the electrodes and the cathode is moved with a speed sufficient to obtain measured values of the cathode polarization potential of zinc deposition on zinc. The measured values are related to the concentrations of impurities, polarization affecting agents, or both and to the concentration ratio between impurities and polarization affecting agents, and the process for zinc recovery is adjusted in response to these relations to obtain optimum zinc recovery.
An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.
The effectiveness of organic additives acting as inhibitors during the electrolytic deposition of metals from aqueous electrolytes, which contain organic additives for improving the deposition of metal, is electrically measured. In order to permit an improved and more reliable check of the effectiveness of the inhibitor and to permit a controlled supply of makeup inhibitors at the required rate, a partial stream of the electrolyte is supplied to flow at a constant velocity in a measuring cell provided with at least three wire electrodes having a fresh conductor surface, a measuring current of 5 mA to 1.0 A is supplied to the electrodes and is maintained, and the slope of the plotted cathode potential-time curve in the range from 0.1 to 50 minutes is taken as a measure of the effective conecentration of the inhibitor. The method can be used to measure the effective inhibitor concentration in an electrolyte used to electrorefine copper and to measure the effective conecentration of brightener in the electrodeposition of metal.
Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order to obtain acceptable copper deposits. Cyclic voltammetric stripping (CVS) methods are available to measure the concentrations of the suppressor and anti-suppressor based on the effects of these additives on the copper electrodeposition rate. The present invention is a method that also uses measurements of the copper electrodeposition rate to determine the concentration of the leveler additive. The other two additives are included in the measurement solution at concentrations determined to provide the optimum compromise between minimal interference, high sensitivity and good reproducibility for the leveler analysis. In this case, measurement precision is greatly improved compared to that provided by inclusion of the interfering additives in the measurement solution at their concentrations in the bath sample at the time of the analysis, which would be the standard analytical procedure.
An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.
