Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal alloy leadframe is bonded to and electrically insulated from the base component. The electronic device is connected to the leadframe. A metal or metal alloy cover is bonded to the leadframe to seal the electronic device within the casing. Each of the modifications includes a technique for effectively removing the heat generated by the electronic device from the casing.
A 51/2" by 53/4" flat ceramic board is bonded to an aluminum frame which serves as a heat sink. The bonding agent intermediate the board and the frame is thermally conductive and comprises an epoxy containing Master Bond EP21TDCAOHT. The formed laminate or bond is capable of withstanding repeated stresses occurring through thermal cycling in temperatures from -60 degrees centigrade to +125 degrees centigrade and vibration and humidity testing.
A 51/2" by 53/4" flat ceramic board is bonded to an aluminum frame which serves as a heat sink. The bonding agent intermediate the board and the frame is thermally conductive and comprises an epoxy containing Master Bond EP21TDCAOHT. The formed laminate or bond is capable of withstanding repeated stresses occurring through thermal cycling in temperatures from -60 degrees centigrade to +125 degrees centigrade and vibration and humidity testing.
A semiconductor package has a molded-in-place lead frame (15) resting on a ledge (12b) adjacent a die-receiving trough (13) in a molded housing (10). A one-layer or two-layer flexible tape includes a depending tab (22) on which a die (30) is bonded and positioned within the trough. Electrical bonds are made between bond pads (42) on the die, either by wire bonds (29) or thermo-compression bonding using connector bumps (32), and bond pads on the tape. The tape is laid across a pair of ledges (12a, 12b) with the depending die resting on the bottom of the trough. The tape bond pads are then bonded to inner-extending contact fingers (18) of the lead frame. A single-in-line package is provided in one embodiment wherein integral contacts (17) extend outwardly from fingers (18) exterior of the housing (10).
The present invention relates to a semiconductor casing which permits transmitting ultraviolet rays to a semiconductor chip within the casing. The semiconductor casing includes the substrate formed by a thin metal plate for mounting the semiconductor chip, a ceramic frame fixed to the periphery of the substrate, a ceramic cap which covers the semiconductor chip, is mounted on the ceramic frame and allows transmission of ultraviolet rays, and leads which are sandwiched between the ceramic frame and the ceramic cap to allow the electrical connection of the semiconductor chip.
A hybrid integrated circuit device comprises a metal substrate, a casing member and external leads. An insulating film is formed on the metal substrate, conductive paths are formed on the insulating film, circuit elements are connected to the conductive paths, and conductive pads are formed in the tip portions of the conductive paths. The casing member comprises a sealing portion surrounding the circuit elements and a connector portion projected from the bottom portion of the sealing portion and extending beyond an end of the metal substrate, and formed of insulating resin. Each of the external leads has one end connected to each of the conductive pads and supported by the side surface of the connector portion.
