An electronic connection socket for connecting an electronic package and including a body of nonconductive material, an electronic device fabricated upon a semiconductor substrate located upon the body. The electronic device includes several bonding pads. The socket includes a set of pins to provide interconnection to external electronic devices. The body also includes pin sockets providing interconnection to the electronic package. The pins and pin sockets of the body are also connected to the bonding pads of the electronic device. To provide the electrical interconnection between the electronic package, the electronic device located upon the semiconductor substrate in the socket body and the external circuitry connected to the body.
The invention relates to a circuit plate for the optimal decoupling of circuits with digital integrated circuits. The plate is connected to an SMD capacitor and two conductor tracks connected to the capacitor and leading to the points to be decoupled. The plate is fittable with all precision contact connections present. Furthermore, the plate is adapted to the shape of the IC's or the IC base and, in each case, has a number of bores conforming to the number of contact pins of the IC's or to the number of contact connections of the IC base, whereby the conductor tracks leading to the SMD capacitor are relatively wide and lead to the connections of the points to be decoupled.
An article for tape-automated bonding of integrated circuit microchips comprises a carrier sheet (22) carrying conductive tracks (23) with a tubular metal formation (21) passing through the sheet at the end of each track for connection to a microchip (24). The tubular formations tend to accommodate irregularities in the chip and may contain solder or other metal having a lower melting point than the tubular formation to effect bonding.
A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact portion which are separated by an intermediate portion. A package body encapsulates the semiconductor device die and intermediate portions of the plurality of leads. The first contact portions of the leads are partially exposed on the bottom surface of the package body. The second contact portions extend from the package body along a portion of the package body perimeter. The first contact portions provide bottom-side contacts to the device, while the second contact portions provide peripheral contacts. The second contact portions are shaped into a desired lead configuration or are severed to establish a leadless device.
A space-saving back-up power supply apparatus has length and width dimensions substantially the same as those of a conventional integrated circuit connector. The apparatus includes sockets arranged on its top for making connection to a socket-pluggable integrated circuit such as a standard CMOS RAM, and the apparatus has pins extending from its bottom for making connection to a printed circuit board or connector of a host electronic system. Control circuitry and one or more batteries are located within the apparatus. The back-up power supply is operative to provide power to the socket-pluggable integrated circuit even if the normal power supply of the host electronic system is short-circuited. The control circuitry of the back-up power supply controls the chip enable signal and performs a battery test upon power-up.
A mounting assembly for providing bus termination of a signal line on a printed circuit board (PCB). The mounting assembly includes a connector arrangement, a bus termination device, pressure plate and a clamping mechanism. The bus termination device is received by the connector arrangement, such that electrical interface elements of the bus termination device engage electrical interface elements of the connector arrangement to provide electrical communication between the connector arrangement and the signal line of the PCB. The clamping mechanism is engageable with the bus termination device for maintaining electrical contact between the electrical interface elements for securing the connector arrangement and bus termination device to the PCB. The pressure plate member is interposed between the clamping mechanism and the bus termination board. The pressure plate member protects resistor packages on the bus termination device from damage as a result of clamping forces imparted by the clamping mechanism to the bus termination board through the pressure plate member. The pressure plate member defines a plurality of resistor package pockets for receiving the resistor packages to prevent the clamping forces from being imparted to the resistor packages.
