A chip-shaped piezoelectric vibration part provided integrally with capacitors and resistances, which is so constructed that a piezoelectric element including a pair of vibrating electrodes is housed in a tubular casing whose openings at both axial ends are covered by respective caps, both vibrating electrodes being connected with the caps corresponding thereto through conductive connecting materials, the tubular casing being provided with either one or both of the capacitor and resistance, so that the part is small-sized as a whole to enable its integration degree for package to be improved and is easy to handle.
A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
A chip type electronic part which comprises a chip main body of a cylindrical external shape having a circular cross section, and cap terminals also of a circular cross section applied onto opposite ends of the chip main body. The chip main body is covered, on its side peripheral face not applied with the cap terminals, by an outer covering member having a rectangular cross section, with an interval between a side face of the outer covering member and a corresponding side face of each of the cap terminals being set within a range of +0.2 mm to -0.2 mm.
An improved chip type piezoelectric resonator in which an element having electrode layers formed on main surfaces of a piezoelectric substrate is held in a rubber-like elastic member filled in a through-bore axially formed in a chip-like case having predetermined external dimensions so as to be capable of effecting thickness shear vibration, with a consequent elimination of scattering or deviation in the external dimensions of the piezoelectric resonators.
A tubular piezoelectric oscillator having an electroconductive or non-electroconductive tubular casing, the vacuum interior chamber of which receives piezoelectric oscillating element rectangular plate supported at at least one end thereof by an elastic support element for protecting the piezoelectric oscillating element from thermal deformation and impulsive or vibratory force transmitted from the outside. The interior chamber of the tubular casing is maintained in a vacuum condition by a hermetically sealed pipe-like sealing member or members provided at either one or both axially opposite ends of the tubular casing, at which ends are arranged electroconductive members used as electric leads for extracting an electric oscillating signal from the piezoelectric oscillating element.
A packaged piezoelectric oscillator is provided which comprises an insulating package body, a piezoelectric element, and a lid member. The package body has an upwardly open housing groove which has a bottom surface formed with oscillator electrodes at both ends of the housing groove. The package body is externally formed with first to third electrodes spaced from each other. The first and second electrodes extend into the housing groove for electrical connection to the respective oscillator electrodes, whereas the third electrode is located between the first and second electrodes. The piezoelectric element is fixedly received in the housing groove of the insulating package body and held in electrical conduction with the respective oscillator electrodes. The lid member is attached to the package body to close the housing groove. The lid member has a lower surface formed with first to third capacitor electrodes in electrical conduction with the first to third lead electrodes, respectively.
