A tarnish remover/metal polish formulation comprising water, an acid, and metal iodide, such as potassium iodide, is described. The components of the formulation chemically react with the tarnish or stain on a metal surface, removing the tarnish or stain while leaving the metal unaffected. The tarnish remover/metal polish can be applied as a dip-rinse or as a polish. The composition is easily applied and easily removed.
Photographic processing devices such as stainless steel racks and tanks are cleaned to remove contaminants such as silver by contacting the devices with a cleaning solution comprising water, a mineral acid such as nitric acid, a soluble cerium (IV) salt such as ceric ammonium nitrate, and acetic acid. The cleaning solutions have a pH no greater than 1. The acetic acid inhibits the formation of a brown stain on the stainless steel.
Photographic processing devices such as stainless steel racks and tanks are cleaned to remove contaminants such as silver by contacting the devices with a cleaning solution comprising water, a mineral acid such as nitric acid, a soluble cerium (IV) salt such as ceric ammonium nitrate, and acetic acid. The cleaning solutions have a pH no greater than 1. The acetic acid inhibits the formation of a brown stain on in the stainless steel.
A nail lacquer remover of the transparent gel type, consisting essentially of: (1) 30-65% by weight of a carbonate selected from the group consisting of ethylene carbonate, propylene carbonate, butylene carbonate and glycerine carbonate; (2) 10-50% by weight of 1,3-dimethyl-2-imidazolidinone; (3) 0.2-20% by weight of hydroxypropyl cellulose; and (4) 13-40% by weight of water. The nail lacquer remover has low flammability, and does not cause drying and cracking of nails.
A compound containing a tall oil fatty acid, oleic diethanol amide, aluminum oxide abrasive material, and organo-treated bentonite provides a polish for metals, such as aluminum, having a uniform viscosity and the abrasive particles uniformly dispersed throughout the carrier. Water may be added to form a scratch removing compound. Mineral spirits may be substituted for the fatty acid in the scratch remover to form a prepolish compound.
A corrosion inhibitor composition and a method for employing the same to prevent corrosion of copper and copper containing metals in contact are disclosed. Protection is afforded thereto by contacting the metal surface with the medium containing sufficient amount of benzotriazole/its derivatives and halogen, preferentially iodide or bromide ions. The inhibitor has particular utility in protecting metal surfaces which are subject to corrosion in aggressive aqueous systems.
