An ultra thin piezoelectric quartz crystal package can be realized by using adhesive dollops to compliantly mount a piezoelectric device within a thin package. The adhesive dollops maintain spacing between the upper and lower surfaces of the piezoelectric device (18) and the surfaces (13 and 15) of the housing that is comprised of upper and lower substrates (12 and 14).

A crystal oscillator including a crystal element designed to oscillate at a given frequency when subjected to an exciting voltage, and mounted parallel to and on a base through at least a wad made of at least a thin wound wire. Advantageously, the wire is randomly wound and is electrically conductive. The wad is elongated and is disposed parallel to said crystal and to said base.

A method of mounting a piezoelectric element with a substrate. First, a compliant material (206) is dispensed on at least one side of the substrate (102) and cured. Next, a first conductive adhesive (216) is applied on the other side of the substrate (106). Third, a piezoelectric element (102) is positioned over the substrate (106). And thereafter, a second compliant conductive adhesive (222) is selectively dispensed such that it contacts an upper portion of one side of the piezoelectric element (102) and the substrate (106).

A packaged piezoelectric oscillator is provided which comprises an insulating package body, a piezoelectric element, and a lid member. The package body has an upwardly open housing groove which has a bottom surface formed with oscillator electrodes at both ends of the housing groove. The piezoelectric element is fixedly received in the housing groove of the insulating package body and held in electrical conduction with the respective oscillator electrodes. The lid member is attached to the package body to close the housing groove. The housing groove has an intermediate wider width portion, and each end of the housing groove is provided with a pair of end positioning walls projecting toward each other for providing a narrower width portion between the pair of end positioning walls.

In a piezoelectric resonator having an ultrathin vibratory portion formed by a cavity made in a piezoelectric block and a thick frame-like rib formed integrally with said vibratory portion and surrounding it, an excess adhesive receiving groove or the like is cut in one marginal portion of the frame-like rib between an adhesive coated region. The resonator is fixedly housed in a package by use of an adhesive coated on one marginal portion of the frame-like rib along the z-axis direction, or by means of elastic pawls without using the adhesive. In this case, one marginal portion of the frame-like rib on the opposite side from a pad deposited on one side of the piezoelectric resonator is bonded to the bottom of the package. With such a structure, it is possible to prevent the adhesive from flowing into the cavity to cause variations in the resonance frequency of the piezoelectric resonator, to reduce the scatter of the temperature-frequency characteristic of a piezoelectric device using the resonator housed in a package during mass production, and to increase the bond strength of wire bonding for electrical connection of the piezoelectric resonator incorporated in the package.