There is disclosed a compact high power modular RF Semi-Conductor systems package suitable for constructing RF sources of high power and compact size comprising a liquid coolant conduit incorporating side-by-side input and discharge conduits, said conduit attached at one end to a master coolant conduit; liquid cooled microwave semi-conductor device modules comprising input and output liquid coolant connectors at one end and RF output coupling means at the other end, said modules being mounted on two opposing surfaces of said liquid conduit there being multiple adjacent modules in close proximity to each other on each side, and along the length of said conduit, each module having input and discharge liquid couplers fastened respectively to corresponding input and discharge conduits of said conduit, there being RF coupling means mounted on the opposing ends of said module from said coolant connectors, said RF coupling means joining adjacent modules in such manner that the sum of the RF power output of all modules on each side of said conduit transmitted through successive couplers is additive and is substantially equal to the power delivered from the last coupler into an output wave guide or other RF transmission means; and, there being a number of RF subsystems set side by side, each having a coolant conduit coupled to said master coolant conduit, and, each module mounted on said coolant conduit having RF coupling means mounted on the opposing surface of said module, said RF coupling means additively joining adjacent modules and thence delivering the summed RF power into said output waveguide.

There is disclosed a liquid cooled multi-chip semi-conductor module comprising multiple semi-conductor devices each having one surface prepared with electrical interconnect means for mechanical and electrical attachment to an electrical interconnect substrate, said semi-conductor device having a surface opposing said surface prepared with said electrical interconnect means, said opposing surface being a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, one surface of said conduit having apertures corresponding in placement and geometry to said heat transfer surfaces of said semi-conductor devices mounted on said electrical interconnect means wherein said heat transfer surfaces and said conduit surface containing said apertures are approximately coincident thereby providing an approximately hydraulically smooth surface for the flow of coolant thereby minimizing undesirable flow characteristics such as cavitation and vortex shedding.

There is disclosed a liquid cooled high power semi-conductor structure comprising multiple stacked semi-conductor devices each having at least one surface prepared with a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, there being multiple semi-conductor devices stacked with heat exchange surfaces of adjacent or semi-conductor devices opposing each other, said heat exchange surfaces being spaced apart to form a coolant conduit, the several coolant conduits being fed coolant in parallel by a common input conduit and the discharge coolant feeding in parallel into a common discharge conduit, said stacked semi-conductor devices being electrically connected in series or some combination of series parallel.

A semi-conductor assembly including an elongated electrically conductive support structure defining a sinuous coolant flow path between respective upper and lower surfaces of the support structure. The sinuous coolant path includes alternating concave and convex coolant surfaces. A first series of semi-conductor devices is secured in a thermally intimate manner to the upper surface of the support structure, and a second series of semi-conductor devices is secured in a thermally intimate manner to the lower surface of the support structure. Each semi-conductor device is disposed proximate a concave curved surface of the coolant path.

There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink of modular construction suitable for semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said modular heat sink containing inserts with chip substrates made of metals, such as tungsten or molybdenum, said substrate including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said module providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat sink module comprises individual heat sink inserts upon which semi-conductor chips are intimately bonded, said heat sink element being provided with means to electrically isolate each heat sink element from all other heat sink elements mounted on said heat sink module, said heat sink elements having their corresponding liquid cooled surface directly opposing said semi-conductor chip, the heat transfer characteristics of said liquid cooled surface being unobstructed by said electrically isolating means.