An apparatus and method for wafering an ingot of semiconductor material. Wafering blades are fabricated from one or more layers of a fiber reinforced plastic tape and coated with an abrasive material which is embedded into the exposed flat surfaces of the blades. An assembly of such blades is used in a wafering device in which the blades are reciprocated while the ingot is plunged against the cutting edges of the blades. The primary cutting action occurs as exposed ends of the fiber material at the blade edges contact the ingot. The abrasive material on the blade sides provides additional side cutting action and produces a polished finish on the surfaces of the resulting wafers.
A method of making a cutting blade using a fiber composite tape formed into a continuous closed loop. The tape is selected and prepared such that at least some of the fibers form an acute angle with the cutting edge.
A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly minimized and the work environment can also be kept clean. Further, excellent surface smoothness can be realized on the cut wafers.
A method of making a cutting blade using a fiber composite tape formed into a continuous closed loop. The tape is selected and prepared such that at least some of the fibers form an acute angle with the cutting edge.
The invention concerns a method of cutting blocks of hard materials into plates by the action of an abrasive, which is added in the loose state, and of a continuous, revolving, fixed carrier. As a result of being guided in peripheral grooves in coaxial rollers of a roller system, the carrier forms a chain through which the material to be cut is pressed. The carrier, which runs in the peripheral grooves in the rollers of a roller system comprising at least one pair of deflection rollers and at least one pair of guide rollers, is pressed into the material to be cut such that it is guided in opposite directions in respectively two adjacent cuts in the block.
