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Description  |
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BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor memory device. More
specifically, the present invention relates to an improvement in a data
write checking circuit in a 5V-only electrically erasable programmable
read only memory referred as EEPROM hereinbelow.
2. Description of the Prior Art
FIG. 1 is a schematic block diagram showing a data write system
configuration in a conventional EEPROM. Referring to FIG. 1, a
conventional, page-mode operable semiconductor memory device, in which
storage region is a memory cell array 1 constituted of EEPROM cells,
includes a row address buffer 2 and a column address buffer 3 which
receive a row address signal and a column address signal, respectively
wherein these signals specify an address in the memory cell array 1 in the
X-direction (row) and Y-direction (column), respectively, and an input
buffer 8 which receives data to be written into a memory cell selected in
accordance with the address signal.
A row address latch 4 and a row decoder 6 are provided in the X-direction
path. The row address latch 4 receives row address signals from the row
address buffer 2 and latches to hold the same. The row decoder 6 receives
row address signals from the row address latch 4, and decodes the same to
select a specified row by the row address signal in the memory cell array
1.
A column address latch 5 and a column decoder 7 are provided at the
Y-direction path. The column address latch 5 receives, latches, and holds
column address signals from the column address buffer 3. The column
decoder 7 receives column address signals from the column address latch 5
and decodes the same to select a specified column by the column address
signal in the memory cell array 1.
A data latch 9 and a column latch 10 are provided at the data input system.
The data latch 9 receives, latches, and holds data from the input buffer
8. The column latch 10 can hold one page volume of data from the data
latch 9, corresponding to the decoded signals from the column decoder 7.
A sense amplifier 11, a comparator 12, and a write/erase controller 13 are
provided at a data write checking path. The sense amplifier 11 senses to
amplify the data written into the memory cell array 1. The comparator 12
receives the data from the sense amplifier 11 and data latched in the data
latch 9 to compare the same so as to check whether the written-in data is
identical with the latched data. The write/erase controller 13 controls
the write and the erase operation into the memory cell array 1.
It takes several to ten milliseconds to write data into a memory cell in an
EEPROM device. Accordingly, when the data is written in byte by byte, like
in a static RAM (random access memory), it takes several tens to 80
seconds to write data into all bits of a 64K bits EEPROM, having 8K
words.times.8 bits configuration. In order to eliminate the above
disadvantage, the page mode write function enabling to write several bytes
at one time has been standardly provided in EEPROM devices having
integration equal to or higher than 64K bits.
If the page mode function enables 16 bytes to be written as one page during
one operation cycle, the period required to write data into all bits
reduces to 1/16, and writing into all bits can be completed within 5
seconds.
FIG. 2 is a timing chart showing each control signal timing in a page mode.
In FIG. 2, a signal CE represents an active low chip enable signal; a
signal WE, an active low write enable signal. Referring to FIGS. 1 and 2,
the page mode operation is briefly described in the following. A write
cycle in the page mode consists of two cycles. In this disclosure, one
cycle is called an external write cycle and the other, an internal write
cycle.
In the external write cycle the memory device can be controlled from the
outside and data can be written into the memory device in the same way as
that in static RAMs. The data written at this time, however, is not
actually written into the memory cells, but only stored in the latches
provided correspondingly to each column, or the column latch 10. Since a
page cannot be turned over during the page mode write operation, the page,
or the row address, must be held constant.
When the external write cycle is completed, the memory device does not
receive the externally applied control signals CE and WE, and the flow
goes into the internal cycle, wherein the data stored in the column latch
10 are actually written into the memory cells.
FIG. 3 is a flow chart showing the operation flow of the page mode writing.
Referring to FIGS. 1 through 3, especially to FIG. 3, the write checking
operation in the page mode writing is further described.
First, the external write cycle starts at the fall of both signals CE and
WE (S1). At this time, a timer in the controller 13 is activated in
response to the fall of the signal WE, as shown by the arrow in FIG. 2,
and the timer output turns to "H" to enable external writing. Under this
condition, row and column addresses are input to the row address buffer 2
and the column address buffer 3, (S2).
Then, the row address latch 4 and the column address latch 5 latch the
supplied addresses through the row address buffer 2 and the column address
buffer 3, (S4).
Data are entered into the input buffer 8 at the rise of the signal WE (S6).
The data are latched in the data latch 9 through the input buffer 8, and
then, latched in the column latch 10, which is able to latch one page
volume of data (S8). While the timer output continues to be at "H" (for
200 microseconds), this cycle repeats while holding the row address
constant (S10), and one page volume of data are latched to the column
latch 10 byte by byte. Writing data into the column latch 10 is
automatically terminated after 200 microseconds by the timer even if all
data of one page volume are not latched to the column latch 10, and then,
the internal write cycle starts.
At this time, the signal "Ready/Busy" (not shown in the figure) generated
synchronizing with the timer output changes from "H" to "L", and the
access from the outside is ignored.
The one page volume of data which has been written into the addressed
memory cells are erased under the control of the write/erase controller 13
before the data write into the addressed memory cells starts.
Under the erased state, the memory transistor in the memory cell has
electrons injected into its floating gate and indicates the positive
threshold voltage.
In the following description, this erased state is regarded as the state
wherein the information "1" is memorized. When the electrons are
conversely discharged from the floating gate of the memory transistor;
that is, the transistor indicates the negative threshold voltage, this
situation is regarded as a state wherein the information "0" is memorized.
After the one page volume of information is erased, one-byte data are read
from the last memory cells in the memory cells included in the addressed
one page under the control of the controller 13 and the read-out data are
compared with "1"s in the comparator 12 through the sense amplifier 11.
The erase checking of one page volume of data is completed when there is
coincidence in the above comparison (S12).
After the erase operation of the one page volume of data is confirmed, the
one page volume of data latched in the column latch 10 are written into
the page specified by the row address (S14).
All memory cells in the addressed one page into which data are to be
written are set to "1" by the previous erase operation (S12) so that the
actual write operation ts each required memory cell to "0."
After completing the external write cycle, the addresses latched in the row
address latch 4 and the column address latch 5 and the data latched in the
data latch 9 correspond to the addresses and data of one byte of the last
input data in the page, respectively.
Next, under the control of the controller 13, the information in the memory
cells selected by the last address is read through the sense amplifier 11
(S16), and the information is compared with the data latched in the data
latch 9, at the comparator 12 (S18).
If the read-out information coincides with the latched data, the page write
is terminated (S20). In the case of incoincidence, the operation flow
returns to the step 14 and the write cycle is repeated.
In a conventional semiconductor memory, write checking is executed using
the one byte data last written into the page. Accordingly, when all of one
byte data entered last are equal to "1", the corresponding memory cells
indicate the same conditions as in the erased state so that it is
impossible to confirm whether or not writing data into this page is
completed.
The circuit to check the data write/erase operation in an EEPROM is
disclosed in "An Enhanced 16K E.sup.2 PROM", L. GEE et al., IEEE JOURNAL
OF SOLID-STATE CIRCUITS VOL. SC-17, NO. 5, OCT. 1982, pp. 828-832.
This prior art, however, discloses a circuit that checks data write/erase
operations in the byte mode writing only. It discloses nothing about a
circuit that confirms data write/erase operations in the page mode.
SUMMARY OF THE INVENTION
It is the primary object of the present invention to eliminate the above
described disadvantages and provide a semiconductor memory device which
can reliably check a writing operation using one byte memory cells into
which data including a "0" are written.
A semiconductor memory device according to the present invention comprises
a data detecting means which detects whether or not a predetermined value,
preferably "0", which indicates the memory cell is not in the erased
state, is contained in the input data, an address latch means and a data
latch means which latch the address of the memory cell for said input data
including the predetermined value to be written and the input data,
respectively, responsive to the detection signal from said data detecting
means, a data read means which selects a memory cell based on the address
stored in said address latch means to read out data therefrom at the write
checking, and a comparing means which compares the data from said data
read means with the data stored in said data latch means.
Preferably, the operation of the address latch means at the write checking
is controlled by the inverted signal of the Ready/Busy signal which is
internally generated for controlling the external access to the memory
cell array. Moreover, the address latch means and the data latch means are
preferably provided independently from the ordinary address latch for
holding addresses and the data latch for holding data.
The semiconductor memory device according to the present invention detects
whether or not one byte in the input data includes a "0." When the data
includes a "0", the address and the data corresponding to the input data
are selectively latched to the address latch and the data latch. At the
write checking, the data are read based on the address latched in the
address latch. These read data are compared at the comparator with the
data stored in the data latch so that the write checking can be reliably
executed.
These object and other objects, features, aspects and advantages of the
present invention will become more apparent from the following detailed
description of the present invention when taken in conjunction with the
accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic block diagram showing a conventional semiconductor
memory configuration;
FIGS. 2(a)-2(e) are timing charts showing each control signal timing in a
semiconductor memory;
FIG. 3 is a flow chart showing a data write operation flow in a
conventional semiconductor memory;
FIG. 4 is a schematic block diagram showing a semiconductor memory
configuration according to an embodiment of the present invention; and
FIG. 5 is a flow chart showing a data write operation flow in an embodiment
of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to the drawings, an embodiment of the present invention is
described in the following.
FIG. 4 is a schematic block diagram showing a semiconductor memory
configuration according to an embodiment of the present invention.
Referring to FIG. 4, the semiconductor memory device according to the
present invention comprises an input data detector 14 which detects
whether or not a data of one byte includes a "0", wherein the one-byte
data are entered through the input buffer 8 which receives the data to be
written, a second column address latch 15 which latches to hold the column
addresses from the first column address latch 5 responsive to the
detection signal (I) from the input data detector 14, and a second data
latch 16 which latches to hold the data from the first data latch 9
responsive to the detection signal (I) from the input data detector 14, in
addition to the conventional semiconductor memory configuration.
In the configuration, the first column address latch 5 and the first data
latch 9 are latches for holding address and data respectively provided in
a conventional semiconductor memory.
The second column address latch 15 and the second data latch 16 are
configurated so that they latch the address and the input data,
respectively only when the input data includes "0."
In addition, in order to control the transfer operation of the column
addresses between the first column address latch 5 and the second column
address latch 15, an inverted signal (II) of the Ready/Busy signal is sent
to the second column address latch 15 from the write/erase controller 13.
Under the external write cycle, the column address is transferred from the
first column address latch 5 to the second column address latch 15 by the
inverted signal (II). On the other hand, under the internal write cycle,
the column address is transferred from the second column address latch 15
to the first column address latch 5 by the inverted signal (II).
The data from the first data latch 9 are also transferred to the column
latch 10, although this flow is not shown in FIG. 4 for the simplicity of
the figure. The comparator 12 is configurated to compare the read data
from the memory cell array through the sense amplifier 11 with the data
latched in the second data latch 16, under the control of the controller
13.
FIG. 5 is a flow chart showing the write checking operation flow in a
semiconductor memory device according to the embodiment of the present
invention. Referring to FIGS. 4 and 5, the operation is described in the
following.
As similar to a conventional memory device, the write operation starts at
the fall of the signal WE when the signal CE is active in "L" (S20).
Responding to this operation start, the row address buffer 2 and the column
address buffer 3 receive the row and column addresses (S22) and transfer
the received addresses to the row address latch 4 and the first column
address latch 5, respectively. The row address latch 4 and first column
address latch 5 latch each receives the address signal to latch (S24).
Next, the input buffer 8 receives the data to be written (S26).
Responsive to the rise of the signal WE, the data to be written are
transferred from the input buffer 8 to the first data latch 9 and the
column latch 10, and the data are latched in them (S28). At the same time,
the data entered to the input buffer 8 are also supplied to the input data
detector 14, and the detector 14 determines whether or not the data
include a "0" (S30). The input data detector 14 transfers the signal (I)
to the second column address latch 15 and the second data latch 16,
depending on the content of the received data.
If the input data include a "0", the second data latch 16 latches the data
received from the first data latch 9 responsive to the detection signal
(I).
The second column address latch 15 receives the inverted signal (II) of the
Ready/Busy signal generated from the write/erase controller 13 and
receives the column address from the first column address latch 5
responsive to the signal (II). Accordingly, the second column address
latch 15 also latches the transferred column address, responsive to the
"0" detection signal (I) from the input data detector 14 and to the signal
(II) (S31).
This cycle is repeated for 200 microseconds under the control by the output
of the timer included in the write/erase controller 13 (S32).
One page volume of the input data are latched in the column latch 10 by
this cycle. This operation of the column latch 10 to latch the one page
volume of data is the same as in the conventional memory. The above
described operation is the external write cycle and the Ready/Busy signal
is in the "H" state for this period.
When an output from the timer included in the controller 13 turns to "L",
the Ready/Busy signal also turns to "L" synchronizing with the timer
output so that access from the outside is ignored and the internal write
cycle starts.
The second column address latch 15 transfers the latched column address
therein to the first column address latch 5, responsive to the inverted
signal (II) of "H" (S34).
At the same time, the information in the page specified in the external
write operation, or the information in the memory cells on the identical
row into which the data should be written, is erased under the control of
the write/erase controller 13. Subsequently, one-byte data from the last
memory cell in the one page are read through the sense amplifier 11 under
the control of the controller 13, and the data are by the comparator 12
whether all of them are equal to "1." If the read data contain a "0", the
erase operation is repeated again. When all of the read data are equal to
"1", the operation flow advances to the next step (S36).
The data latched in the column latch 10 are written into the selected
memory cells in the same page under the control of the write/erase
controller 13 (S38).
After the write operation of all data in the column latch 10 is completed,
the write checking operation is executed under the control of the
controller 13 as follows:
The column address for the last input data including a "0" in the page, has
been transferred to the first column address latch 5 from the second
column address latch 15.
According to the transferred address, access to the memory cells is
executed so that the one-byte data in the memory cells is read after the
write completion and transferred to the comparator 12 through the sense
amplifier 11 (S40).
The data latched in the second data latch 16 are also transferred to the
comparator 12. The comparator 12 compared the read data through the sense
amplifier 11 with the data latched in the second data latch 16 (S42).
If those data do not coincide with each other, the operation flow returns
to the step 38 and the write operation is repeated. When those data
coincide with each other, the write operation is terminated (S44).
As described above, the write checking operation is executed for the memory
cells of one byte into which at least a "0" is written.
In the above described embodiment, the memory device is configurated so
that the read data are compared with the data latched in the second data
latch 16. The same advantage, however, can be attained by the
configuration wherein the read data are compared with the data latched in
the column latch 10, instead of the data in the second data latch 16.
As apparent from the above description, a semiconductor memory device
according to the present invention is configurated to hold a one-byte
address and data containing a "0" out of the one page volume of data to be
written and to execute the write checking operation using the data
including a "0" so that the write operation into the memory cell including
a "0" is surely checked and the reliability of writing is improved.
Although the present invention has been described and illustrated in
detail, it is clearly understood that the same is by way of illustration
and example only and is not to be taken by way of limitation, the spirit
and scope of the present invention being limited only by the terms of the
appended claims.
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Description  |
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