A jig for finishing of the blades of a turbo machine and which includes a cylindrical body on the peripheral of which are formed seatings and an annular strap or collar serves to lock the blades in place. A flange enables the jig to be mounted on a driving machine when the jig is partly immersed in an abrasive-containing enclosure which serves to effect the desired finishing of the blade tips or roots which protrude beyond one end of the cylindrical body.
The present invention provides a method for manufacturing an integrated circuit using a polishing head in a polishing apparatus. In one advantageous embodiment, the polishing head comprises a wafer carrier having an outer periphery and a wafer holder. The wafer holder is coupled to the wafer carrier and depends from the outer periphery thereof. The wafer holder is configured (i.e., designed) to grip an edge of the semiconductor wafer.
