An electrical connector comprises a plurality of signal contacts (20,30) disposed in two rows in an insulating housing (10) and each having one end for connection to respective signal wires (S) in an electric cable (1) and another end for connection with a signal terminal of a member to which the connector is to be connected, a plurality of ground contacts (62) disposed in a row between the two rows of signal contacts (20,30) and having one end for connection to ground wires (G) in the cable (1) and another end for connection with a ground terminal of the member to which the connector is connected, and a shield member (60) disposed between the signal contacts to prevent crosstalk therebetween.
This connector assembly comprises a header 1 to which a plurality of coaxial cables 3 are connectable and a socket 2 configured to be mounted on a printed board 4. The header 1 can be detachable coupled to the socket 2. The header 1 has a first terminal array 12 to which the coaxial cables 3 are electrically connectable. The socket 2 has a second terminal array 21 which makes contact with the first terminal array 12 when the header 1 is coupled to the socket 2. The first terminal array has a plurality of first terminals each having a wire terminal 120 for connection with each conductive wire of the cables and a contact 122 for contact with the second terminal array. The feature of the present invention resides in that the wire terminals 120 are arranged in a line, and the contacts 122 of the first terminal array are arranged in two rows in a staggered configuration, and a pitch of the contacts 122 of each row is larger than a pitch of the wire terminals 120.
An insulation displacement connector that includes a plurality of apertures disposed through a mating face and a ribbon-contacting face of the insulation displacement connector. The mating face is configured to mate with a complementary connector complementary in gender to the insulation displacement connector. The ribbon-contacting face is disposed opposite the mating face and configured for coupling with an interspersed ground conductor ribbon cable having a plurality of parallel insulated conductors. The insulation displacement connector includes a plurality of first conductor coupling structures. Each of the first conductor coupling structures is disposed in one of the plurality of apertures and is configured to couple to one of first designated conductors of the plurality of parallel insulated conductors and a contact on the complementary connector when the complementary connector is coupled to the insulation displacement connector at the mating face. The insulation displacement connector further includes a second conductor coupling structure disposed at the ribbon-contacting face. The second conductor coupling structure is configured to couple with a second designated conductor of the plurality of parallel insulated conductors different from the first designated conductors. The second designated conductor is coupled to ground during use and represents a shielding ground conductor to reduce inductive crosstalk between first selected ones of the first designated conductors.
In one embodiment of a two-channel SCSI-compatible interconnection system and method, a dielectric material into which SCSI data and control signal carrying wires are embedded frees ground wires in the SCSI cable to carry first and second SCSI channels so that one conventional SCSI cable and cable connector can support two separate SCSI channels without signal ground wires. In another embodiment of a two-channel SCSI compatible interconnection system and method, a high-density, 100 position dual channel SCSI connector having connector positions doubled in number and spaced at halved intervals relative to a conventional SCSI cable connector supports two separate SCSI channels. In this embodiment, a single one hundred (100) wire SCSI cable or two (2) fifty (50) wire SCSI cables may be attached to the high-density dual channel SCSI connector. In all embodiments, the SCSI channel handling capability is effectively doubled over the heretofore known SCSI connectors for a given connector size or footprint.
A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.
An improved high speed connector is provided in which conductive pads (34) are alternately disposed on both sides of a board (10). The conductive pad (34a) transmits a + differential signal, and the conductive pad (34b) transmits a - differential signal. These conductive pads are disposed on the same surface (10a). The pad (34c) used for grounding is disposed on the opposite surface (10b) so that this pad (34c) is positioned between the conductive pads (34a) and (34b), thus forming one set of pads. In the case of the conductive pads (34d), (34e) and (34f) of another adjacent set, the pad (34d) which transmits a - differential signal is disposed on the same side as the pad (34b) of the previous set which transmits the same - differential signal. The pad (34f) used for grounding is disposed on the opposite side from the pads (34d) and (34e). The pad of a third set which is adjacent to the pad (34e) that transmits a + differential signal is a pad that transmits the same + differential signal. As a result, signal crosstalk is reduced.
