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Claims  |
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What is claimed is:
1. A process for producing a conductive polymer blend which comprises:
mixing a polyimide or polyimide precursor with a conductive polymer
comprising a base-type polymer containing carbon-nitrogen linkages having
a polyimide-like group covalently linked to nitrogen atoms of said
base-type polymer, in a suitable solvent, said polyimide-like group having
the structural unit
##STR13##
wherein a --C0 group of said structural unit is convalently linked to
said nitrogen atoms, and employing about 1 to about 99% of said base-type
polymer andn about 1 to about 99% of said polyimide or said polyimide
precursor, by weight,
removing said solvent, and
forming a conductive continuous phase blend of said polyimide and said
conductive polymer.
2. The process of claim 1, employing said precursor, including the step of
heating the mixture after removing said solvent to form a polyimide.
3. The process of claim 1, said base-type polymer selected from the group
consisting of polyaniline, its naphthyl and biphenyl derivatives, and
alkyl and aryl substituted polyaniline and its alkyl and aryl substituted
naphthyl and biphenyl derivatives.
4. The process of claim 1, said polyimide-like group being derived from a
polyimide oligomer terminated by anhydride groups.
5. The process of claim 1, wherein said base-type polymer is polyaniline.
6. The process of claim 1, employing a polyimide precursor selected from
the group consisting of polyamic acid, a mixture of a dianhydride and a
diamine, and a polyisoimide, and including heating the mixture of a
conductive polymer and polyimide precursor after removal of solvent to
convert the precursor to polyimide.
7. The process of claim 6, wherein said base-type polymer is polyaniline.
8. A process for producing a conductive polymer blend which comprises:
reacting a base-type non-conductive polymer containing carbon-nitrogen
linkages with an effective amount sufficient to increase electrical
conductivity of a carbonyl anhydride containing a polyimide-like
structural unit, and forming a conductive base-type polymer containing
carbon-nitrogen linkages and having a polyimide-like group covalently
linked to nitrogen atoms of said base-type polymer, said polyimide-like
group having the structural unit
##STR14##
wherein a --C group of said structural unit is convalently linked to
said nitrogen atoms,
mixing a polyimide or a polyimide precursor with said conductive base-type
polymer in a suitable solvent, employing about 1 to about 99% of said
conductive base-type polymer and about 1 to about 99% of said polyimide or
said polyimide precursor, by weight,
removing said solvent, and
forming a conductive continuous phase blend of said polyimide and said
conductive polymer.
9. The process of claim 8, said carbonyl anhydride being a dianhydride.
10. The proces of claim 8, said carbonyl anhydride having the formula:
##STR15##
11. The process of claim 8, said carbonyl anhydride being a polyimide
oligomer terminated by anhydride groups.
12. The process of claim 8, said carbonyl anhydride being a polyimide
oligomer having the formula
##STR16##
13. The process of claim 8, said base-type non-conductive polymer being
polyaniline.
14. The process of claim 8, said base-type non-conductive polymer being
polyaniline and employing a polyimide precursor selected from the group
consisting of polyamic acid, a mixture of a dianhydride and a diamine, and
a polyisoimide, and including heating the mixture of a conductive polymer
and polyimide precursor after removal of solvent to convert the precursor
to polyimide.
15. An electrically conductive polymer materiall of comprising a continuous
phase blend of a polyimide and atype base-type conductive polymer
containing carbon-nitrogen linkages and having a polyimide-like group
covalently linked to nitrogen atoms of said base-type polymer, said
polyimide-like group having the structural unit
##STR17##
wherein a --C0 group of said structural unit is convalently linked to said
nitrogen atoms,
said electrically conductive polymer material containing about 1 to abou
99% of said base-type conductive polymer andn about 1 to abou 99% of said
polyimide, by weight.
16. The electrically conductive polymer material of claim 16, containing
abou 50 to abou 99% of said base-type conductive polymer and about 1 to
about 50% of said polyimide, by weight.
17. The electrically conductive polymer material of claim 15 said base-type
polymer selected from the group consisting of polyaniline, its naphthyl
and biphenyl derivatives, and alkyl and aryl substituted polyaniline and
its alkyl and aryl substituted naphthyl and biphenyl derivatives.
18. The electrically conductive polymer material of claim 17, said
polyimide-like group being derived from a polyimide oligomer terminated by
anhydride groups.
19. The electrically conductive polymer material of claim 15 wherein said
polyimide-like group is derived from 3,3',4,4'-benzophenone
tetracarboxylic dianhydride.
20. The electrically conductive polymer material of claim 18, said
polyimide-like group being derived from the polyimide oligomer having the
following structure:
##STR18##
21. The electrically conductive polymer material of claim 15, said
base-type polymer being polyaniline.
22. The electrically conductive polymer material of claim 15, said
polyimide-like group being derived from a polyimide precursor.
23. The composition of claim 20, said base-type polymer being polyaniline.
24. A composition suitable for foroming an electrically conductive polymer
material comprising a mixture of a polyimide precursor selected from the
group consisting of polyamic acid, a mixture of a dianhydride and a
diamine, and a polyisoimide, and a base-type conductive polymer containing
carbon-nitrogen linkages and having a polyimide-like group covalently
linked to nitrogen attoms of said base-type polymer, said polyimide-like
group having the structural unit
##STR19##
wherein a--C group of said structural unit is convalently linked to said
nitrogen atoms,
said electrically conductive polymer material containing about 1 to about
99% of said base-type conductive polymer and about 1 to about 99% of said
polyimide precursor, by weight.
25. A conductive polymer blend produced by the process of claim 1.
26. A conductive polymer blend produced by the process of claim 8.
27. A conductive polymer blend produced by the process of claim 13.
28. A conductive polymer blend produced by the process of claim 14.
29. The process of claim 8, the molar proportions of said carbonyl
anhydride to said base-type non-conductive polymer ranging from about 0.01
to abou 2 said --C per nitrogen of said polymer.
30. The process of claim 13, the molar proportions of said carbonyl
anhydride to said polyaniline ranging from about 0.01 to about 8, per
polymer repeat unit. |
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Claims  |
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Description  |
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BACKGROUND OF THE INVENTION
This invention relates to the production of electrically conductive polymer
materials and is particularly concerned with the production of such
materials exhibiting improved mechanical properties, processability, and
thermal and environmental stability, and with procedure for producing
same.
The free-base form of polyaniline is believed to comprise subunits having
the formula:
##STR1##
where n is between 0 and 1. The oxidation state of polyaniline referred to
as "emeraldine" is believed to have a value of n of about 0.5.
This free-base form of polyaniline is an electrical insulator. Reaction of
emeraldine free-base with protonic acids of the form HX, where X is, for
example, Cl, causes the polymer to undergo an insulator to conductor
transition, as disclosed in A. G. MacDiarmid, et al, Mol. Cryst. Liq.
Cryst. 121, 173 (1985). Conductive polyaniline of this type has been
employed in batteries as disclosed, for example, in French Patent No.
1,519,729.
However, a number of difficulties have been encountered with the prior art
materials noted above. Thus, the conductive polyaniline acid salts are,
with a few exceptions, insoluble in most solvent media. None of the
polyanilines can be melted. The emeraldine free-base and the conductive
forms thereof noted above tend to form powders on removal of the solvent.
With some effort, films can be cast; however, they are quite fragile and
brittle, easily crumbling to form a powder. The conductive acid salts lose
their conductivity when exposed to liquid water. This loss is due to
deprotonation. The conductivity loss is reversible; treatment of othe
deprotonated material with protic acids restores the conductivity.
Further, conductive regions in an insulating matrix tend toward diffusion.
For example, if one makes a conductive trace of polyaniline acid salt on a
substrate of emeraldine free-base, the trace remains spatially stable for
only a short time, eventually spreading out until the substrate has a
constant conductivity throughout.
Some of these problems were addressed in U.S. Applications Serial No.
920,474 filed Oct. 20, 1986, now U.S. Pat. No. 4,798,685, of S. I.
Yaniger, and Ser. No. 013,305 filed Feb. 11, 1987, now U.S. Pat. No.
4,806,271, of S.I. Yaniger, et al, both assigned to the same assignee as
the present application. In these applications, it is disclosed that Lewis
acids, for example, alkylating agents, can be used to make the insulating
emeraldinen free-base into a conductive polymer salt. Use of proper Lewis
acids resulted in conductive polyanilines with the Lewis acid as a side
chain. These derivatized polyanilines are more water stable and
processable than the prior art emeraldine acid salts. Additionally, no
diffusion between "doped" conducting and "undoped" insulating regions was
observed.
Thus, in the above U.S. application, Ser. No. 920,474, a base-type
non-conductive polymer, such as polyaniline, can be reacted with, for
example, methyl iodide, to form an electrically conductive polymer in
which the methyl group is covalently linked to the nitrogen atoms of the
polymer.
In the above U.S. application, Ser. No. 013,305, emeraldine free-base can
be reacted with reagents of the form RSO.sub.2 C1, e.g., tosyl chloride,
to form an electrically conductive polymer in which the -SO.sub.2 R groups
are covalently linked to the nitrogen atoms of the polymer.
U. S. Application Ser. No. 158,477 filed Feb. 22, 1988, of S.I. Yaniger and
R. E. Cameron and assigned to the same assignee as the prsent application,
discloses reaction of a base-type non-conductive polymer, such as
polyaniline, with an anhydride, such as tosylic anhydride or benzophenone
tetracarboxylic dianhydride, and forming an electrically conductive
polymer in which the --SO.sub.2 R and --COR groups are covalently linked
to the nitrogen atoms of the conductive polymer.
In general, however, the conductive polymers of the above applications tend
to be brittle, resulting in inferior mechanical properties.
It would be desirable to blend the relatively brittle conducting polymer
with a flexible polymer to form a blend having both the desired electrical
properties and good flexibility. A suitable polymer for blending is
polyimide. Polyimides have, in general, good mechanical properties,
flexibility and thermostability.
To achieve high electrical conductivity, the proportion of conductive
polymer in the blend must be relatively high (e.g., greater than 50%) in
order for charge to be transferred effectively between polymer chains.
Unfortunately, at high polyaniline loadings, the blend materials tend to
phase separate, that is, the polyaniline aggregates into clumps within the
non-conductive polyimide matrix. These clumps are separated by the matrix
material, and the blend thus is an insulator. Further, the mechanical
properties of the material suffer upon phase separation. It would be
desirable to form blends where the polyaniline is dispersed evenly on a
molecular level at all loadings, to thus form a conductive polymer blend.
An object of the present invention accordingly is the provision of improved
electrically conductive polymer materials of the class of conductive
polyaniline blended with a polyimide.
Another object is to provide conductive polymer materials having improved
flexibility, mechanical properties, and thermal stability in the form of a
continuous phase blend of a conductive polymer, e.g., conductive
polyaniline, and a polyimide.
A still further object is to render polymides conductive by doping with a
conductive polymer, such as polyaniline, to produce an easily processable,
highly thermally stable conductive polymer blend.
A still further object is to provide novel procedure for producing the
above conductive polymer blends.
SUMMARY OF THE INVENTION
The above objects are achieved, according to the invention, by first
reacting a base-type non-cnductive polymer, particularly from the family
of the polyanilines, with a carbonyl anhydride, such as 3,3'
,4,4'-benzophenone tetracarboxylic dianhydride (BTDA), to thereby form an
electrically conductive polymer, e.g., a derivatized polyaniline, having a
polyimide-like group, as defined below, covalently linked to nitrogen
atoms of the base-type polymer. This reaction is described in the above
application, Ser. No. 158,477 of S. I. Yaniger and R. E. Cameron.
The conductive polymer so formed is mixed with a polyimide or polyimide
precursor, in certain ranges of proportions, in a suitable solvent, such
as N-methyl pyrrolidone. For improved miscibility of the conductive
polymer, e.g., derivatized polyaniline, with polyimide, and for best
results, the polyimide contains the same anhydride group as the anhydride
used to derivatize the non-conductive polymer, e.g., polyaniline. Upon
removal of solvent, the mixture forms a continuous phase blend, the
blended materials exhibiting high electrical conductivity and being tough
and flexible. Where a polyimide precursor is employed, after removal of
solvent, the mixture is heated to conver the precursor to polyimide. The
high loading of conductive polymer, e.g., conductive polyaniline,
permitted by the invention process, and the formation of a continuous
phase blend of the conductive polymer and polyimide confer good electrical
conductivity on the polymer blend.
Another advantage of these blends is improved morphology of cast films. For
example, emeraldine free-base has a large optical non-linearity in the
near infrered (about 1 micron wavelength). It cannot at present be used in
non-linear optical devices because cast films of the polymer are fibrillar
in nature and tend to scatter light rather than transmit it. Suitable
polymer blends, according to the invention, form a continuous phase, with
no fibrillar structure. It is again necessary to achieve a high loading of
the polyaniline into the optically inactive polyimide so that the large
optical activity of the emeraldine is not diluted. This cannot be achieved
by prior art technology, as mentioned above.
Another advantage of this invention is that the polyimide matrix serves as
a physical barrier against environmental degradation or hydrolysis. This
is particularly noticeable when fluorinated polyimides are used, since
such polyimides are extremely hydrophobic.
Broadly, the present invention provides a process for producing a unique
conductive polymer blend which comprises mixing a polyimide with a
conductive polymer comprising a base-type polymer containing
carbon-nitrogen linkages having a polyimide-like group covalently linked
to nitrogen atoms of the base-type polymer, in a suitable solvent,
removing the solvent and forming a conductive continuous phase blend of
the polyimide and the conductive polymer.
DETAILED DESCRIPTION OF THE INVENTION AND PREFERRED EMBODIMENTS
A base-type non-conductive polymer containing carbon-nitrogen linkages,
such as polyaniline or emeraldine free-base, is first reacted with a
carbonoyl anhydride, particularly a dianhydride containing a
polyimide-like group having the structural unit:
##STR2##
Specific anhydrides which can be employed are pyromellitic dianhydride
having the following formula:
##STR3##
3,3 '4,4'-benzophenone tetracarboxylic dianhydride having the following
structure: and the fluorinated polyimide oligomer terminated by
anhydrides called 6 FDS/APB and having the structure noted below:
##STR4##
This reaction places polyimide-like groups as side chains connected to the
nitrogen atoms of the base-type polymer containing carbon-nitrogen
linkages, such as polyaniline, and forms an electrically conductive
polymer.
Thus, the reaction between the polyimide oligomer 6 FDS/APB above and
polyaniline results in polyaniline derivatized with polyimide oligomer,
having the following structural unit:
##STR5##
where R=
##STR6##
and R'=
##STR7##
If desired, the base-type polymer containing carbon-nitrogen linkages, such
as polyaniline, can be reacted with two different types of anhydrides,
including (a) one of the carboxylic anhydirdes noted above and containing
polyimide-like groups, and (b) the other being a sulfonic anhydride, such
as tosylic anhydride or trifluoromethane sulfonic anhydride. One of such
anhdrides, that is, the carboxylic anhydride (a) confers solubility and
blendability of the conductive polymer in the desired polyimide matrix,
the other sulfonic anhydride (b) conferring the desired electrical
conductivity on the polymer blend.
The preferred non-conductive polymer employed for reaction with the
anhydride or anhydrides is the basic polymeric starting material,
polyaniline emeraldine free-base (PFB).
In place of polyaniline containing phenyl groups, as noted above, there can
be employed other non-conductive base-type polymeric starting materials of
the polyaniline family, containing naphthalene or biphenyl groups, the
resulting conductive polymers thus produced according to the invention
being analogous base-type conductive polymers containing naphthyl or
biphenyl groups, respectively, and wherein the anhydride groups are
covalently linked to nitrogen. Such polymeric starting materials can
include other non-conductive base-type polymers containing carbon atoms
linked to nitrogen, such as cyanogen polymer containing the recurring
unit:
##STR8##
The starting materials of the invention can also include non-conductive
mixures and blends of thea bove polymers, and copolymers of the above
polymers and other polymers, such as a blend of polyaniline and
polymethylmethacrylate, and polymer alloys, such as
polybenzimidazole-polyimide alloys, containing carbon-nitrogen groups.
Thus, the term "non-conductive polymer" as employed herein is intended to
denote any of the above homopolymer or copolymer materials.
The invention will be described hereinafter, however mostly in terms of the
use of the preferred non-conductive free-base polyaniline as polymeric
starting material for reaction with an anhydride for production of the
preferred highly conductive polyaniline described above.
The process for reacting the non-conductive nitrogen-containing polymer,
such as polyaniline, with the anhydirde or anhydrides, is disclosed in
detail in above application, Ser. No. 158,477, of S. I. Yaniger and R. E.
Cameron, and is incorporated herein by reference.
The molar proportions of anhydride compound to non-conductive
nitrogen-containing polymer free-base can range from about 0.1 to about
two COR.sup.+ groups per nitrogen. In the cae of polyaniline, such molar
proportions can range from about 0.01 to about 8, per polymer repeat unit.
The reaction can be carried out as a heterogeneous reaction wherein the
polymer starting material is not dissolved but is reacted directly with
the anhydride, or the polymer starting material, such as polyaniline
non-conductive free-base, can be dissolved in a suitable solvent which
does not react irreversibly with the anhydride, e.g., N-methyl
pyrrolidone, dimethylsulfoxide (DMSO), dimethylformamide (DMF), formic
acid, dimethylacetamide (DMAC), acetonitrile and pyridine.
The reaction is generally carried out at about ambient or room temperature,
e.g., 20-25.degree.C., or at higher or lower temperatures.
The rate of reaction can range widely, depending on the particular
anhydride reactant employed. Thus, the reaction rate can range from almost
instantaneous to several hours or longer.
In the case of polyaniline free-base, this is a high polymer having a
molecular weight of the order of 50,000 to 80,000. Lower molecular weight
forms of polyaniline can also be employed, such as an oligomer of
polyaniline containing 8 sub-units and having a molecular weight of about
800 to 900.
The conductivity of the resulting conductive polymers, e.g., conductive
polyaniline, can be varied by reducing or increasing the number of
covalently linked polyimide-like side chains, as by controlling the degree
of completeness of the reaction and/or by varying the types of anhydride
or mixed anydrides employed in producing such side chains on the polymer.
Any commercially available polyimide or polyimide precursor is suitable for
blending with the above conductive polymer, e.g., conductive polyaniline,
containing the above-noted polyimide-like side chains.
An example of a suitable polyimide is the commercially available polyimide
marketed as "6F44" by Amercian Hoechst and having the repeat unit:
##STR9##
An example of a polyimide precursor is the material marketed as EYMYD resin
by the Ethyl Corporation, a solution processable polyamic acid having the
repeat unit:
##STR10##
Another example of a polyimide precursor is the 50:50 molal misture of a
dianhydride and a diamine, corresponding to the materials marketed as 6FDA
and APB shown below:
##STR11##
Polyisooimides are further examples of polyimide precursors. On heating,
polyisoimides are converted ot polyimides.
Further, instead of blending the derivatized conductive polymer, e.g.,
polyaniline, with preformed polyimide, or with polyimide precursor, the
non-conductive polyaniline can be mixed with, e.g., a dianhydride and a
polyimide to produce reaction of the polyaniline with the anhydride to
form the derivatized polyaniline in situ with the polyimide.
Alternatively, the non-conductive polyaniline can be mixed with a
dianhydride and a diamine, such as the material marketed as K.sub.2 resin
by DuPont, with a portion of the dianhydride reacting with the polyaniline
to derivatize same, and the remaining portion of the dianhydride reacting
with the diamine to form the polyimide in situ.
Polyimide precursors have the advantage of being more soluble than
polyimide.
Where the polyimide precursors are used in admixture with the derivatized
polymer, e.g., polyaniline, in a solvent, the solvent is first evaporated
and the resin mixture or film is heated to convert thte polyimide
precursor to polyimide.
The conductive polymer containing thte polyimide-like side chains can be
blended in a wide range of proportions with non-conductive polyimide or
polyimide precursor, generally ranging from about 1 to about 99%
conductive polymer to 1 to about 99% non-conductive polyimide or polyimide
precursor, by weight. Particularly to obtain higher conductivity, it is
preferred to employ about 50 to about 99% conductive polymer and about 1
to about 50% non-conductive polyimide or polyimide precursor, by weight.
Such blending can be carried out by mixing the conductive polymer
containing polyimide or polyimide precursor in a suitable solvent, such as
N-methyl pyrrolidone. Other solvents which can be employed are noted
above. If desired, the reaction of the non-conductive base-type polymer,
such as polyaniline, with the appropriate anhydride, can be carried out in
a suitable solvent, such as N-methyl pyrrolidone, and the polyimide or
polyimide precursor can then be added to the resulting reaction mixture
containing the resulting conductive base-type polymer having the anhydride
or polyimide-like side chains. The presence of the polyimide-like side
chains causes the conductive base-type polymer, such as polyaniline, to be
highly soluble, together with the polyimide or polyimide precursor, in the
solvent solution. The bestt solubility is achieved when the dianhydride
side chain of the polyaniline contains the same dianhydride which is in
the polyimide structure with which the derivatized polyaniline is blended.
When the resulting solution is applied to a suitable substrate, such as
SiO.sub.2, and the solvent is evaporated, a tough, flexible film in the
form of a continuous phase blend of the conductive polymer and the
polyimide is obtained, which has high electrical conductivity. Where a
polyimide precursor is employed, as previously noted, the film is heated
to convert the precursor to polyimide. The proportions of base-type
polymer and polyimide in the continuous phase blend forming the conductive
film is the same as that noted above in preparing the solutions of the
blends. It is particularly noteworthy that both the conductive polymer,
particularly conductive polyaniline, and the polyimide, are quite
thermostable at temperature up to about 350 .degree.C., and the resulting
blend of the two polymers is a continuous single phase having high
thermostability. The blended polymer also has the good mechanical
properties of a polyimide while having the good electrical conductivity
properties of the conductive base-type polymer, such as conductive
polyaniline. The continuous single-phase blends of the conductive polymer
and non-conductive polyimides produced according to the invention do not
separate out upon forming a film from the blend.
The following are examples of practice of the invention:
EXAMPLE 1
Emeraldine free-base (6 grams) was dissolved in 250 ml of NMP, and the
solution was filtered through glass wool. 1/8 equivalent per emeraldine
nitrogen of 6 FDA/APB, a polyimide oligomer terminated by anhydrides, was
added, and the reaction was allowed to proceed at room temperature for 24
hours. 6 grams of 6F44 commercial polyimide was added. The solvent was
removed and the polymer blend formed a tough, flexible,d ark blue-black
film having an electrical conductivity of less than 10.sup.- 8 S/cm. No
fibrillar structure was observed.
EXAMPLE 2
The procedure of Example 1 was carried out under an argon atmosphere, with
the addition of 1/2 equivalent per emeraldine nitrogen of tosylic
anhydride into the initial reaction mixture.
A film was cast by means of solvent removal by evaporation. The film had a
conductivity of .05 S/cm and was tough and flexible.
EXAMPLE 3
The procedure of Example 1 was substantially carried out, except that in
place of the polyimide oligomer 6 FDA/APB, the anhydride 6 FDA in the same
proportion was added to the initial reaction mixture.
Following removal of solvent, the polymer blend formed a tough flexible
film having an electrical conductivity similar to that of the film formed
in Example 1.
EXAMPLE 4
The procedure of Example 1 was carried out except the final film was soaked
in an aqueous solution of tosylic acid for 24 hours to yield a film having
a conductivity of .0 S/cm.
EXAMPLE 5
6 grams polyaniline emeraldine free-base was dissolved in 250 ml DMSO
(dimethyl sulfoxide) and the solution was filtered under argon. 1/8
equivalent of pyromellitic dianhydride was added to the solution. EYMYD
resin in DMSO was then added under argon. The solution was stirred for 4
hours. The solvent was then removed to yield a green film. Upon heating,
the green film turned blue showing the polyamic acid had condensed to form
the polyimide.
EXAMPLE 6
The procedure of Example 5 was carried out, except that 1/2 eq. tosoylic
anhydride was added to the DMSO solution prior to removal of the solvent.
EXAMPLE 7
6 grams emeraldine free-base was dissolved in 250 ml formic acid and the
solution was filtered. 6 FDA (1 gram) and 1 gram APB were added to the
solution. The sollvent was evaporated by heating. The solution was then
heated further to yield a conductive film.
EXAMPLE 8
The procedure of Example 7 was carried out, except that 1/2 gram of tosylic
anhydride was added prior to removal of the solvent.
EXAMPLE 9
The procedure of Example 1 was carried out, except that the isoimide having
the repeating unit shown below was used instead of the polyimide 6 F44:
##STR12##
Following removal of solvent, the solution was heated to form a conductive
film.
The electrically conductive polymer blends of the invention have utility in
the production of conductive composites, electronic components, electrical
conductors, electrodes, batteries, switches, electrical shielding
material, resistors, capacitors, and the like.
From the foregoing, it is seen that the invention provides a novel class of
conductive polymer materials which can be readily cast into tough,
flexible conductive films, by reacting certain organic anhydrides,
particularly dianhydrides, with a non-conductive polymer, e.g., base-type
non-conductive polymers such as polyaniline, to provide polyimide-like
chains covalently linked to the nitrogen atoms of such polymers, and
blending the so-formed polymers with a polyimide or polyimide precursor.
The resulting mixture upon removal of solvent, and further heating where a
polyimide precursor is employed, forms a continuous phase blend. In
effect, the present invention renders polyimides conductive by doping with
conductive polymer containing polyimide-like side chains. This results in
easily processable, highly thermally stable conductive polymer blends.
While particular embodiments of the invention have been described for
purposes of illustration, it will be understood that various changes and
modifications within the spirit of the invention can be made, and the
invention is not to be taken as limited except by the scope of the
appended claims.
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