An electronic component is formed by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomer is selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof.
This is a division of application Ser. No. 839,456 , filed Mar. 11, 1986, now U.S. Pat. No. 4,654,223, which is a continuation of application Ser. No. 556,731,filed Nov. 30, 1983, and subsequently abandoned.
A bale debanding method and apparatus comprising a band breaking blade, a band winding mandrel and a mandrel cleaning plate are mounted to a frame. A support table is attached to the frame for receiving a waste paper bale that is held together by banding material. As the bale is moved past the band breaking blade, a band retention notch engages a band and by stretching it breaks the band. Once a band is broken, an extensible band catch extending out of the mandrel contacts the band and facilitates the band in being wound around the mandrel. Once all of the bands have been removed from the bale, the band catch is retracted to a position within the mandrel and a cleaning plate is moved axially along the mandrel sweeping the bands off a free end of the mandrel. This process is repeated to remove bands from other surfaces of the bale, thereby releasing the waste paper in preparation of processing.
The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
An interconnect substrate that includes a multilevel metal-polymer composite incorporating microelectronic circuitry should be economical to construct when the polymer comprises alternating layers of thermoset and thermoplastic resins, each of which is substantially free from groups that are reactive with copper. The layers of thermoset and thermoplastic resins can either alternate in adjacent levels, or each level can include both a layer of thermoset resin and a layer of thermoplastic resin. When each level includes either a thermoset resin or a thermoplastic resin, each such resin preferably has good machinability to permit each level of the interconnect to be planarized mechanically. When there is a layer of thermoset resin and a layer of thermoplastic resin in each level, the thermoplastic resin preferably is at the surface of each level, because a thermoplastic resin usually has better machinability than do thermoset resins.
A multilayer wiring structure produced by using a special poly(amic acid) ester oligomer for making an interlayer insulating film has an almost flattened surface without suffering from level differences of underlying wiring patterns.
A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.
