|
Claims  |
|
|
I claim:
1. A process for applying a metallic hologram to a solid substrate which
comprises the following steps in sequence:
(a) forming a thin metallic hologram;
(b) coating a first side of said thin metallic hologram with a
crosslinkable liquid adhesive resin;
(c) contacting the coating on the thin metallic hologram with a solid
substrate;
(d) curing said crosslinkable liquid adhesive resin to form a tough
solvent-resistant film while said metallic hologram and said solid
substrate are in contact with said crosslinkable liquid adhesive resin;
(e) coating a second side of the thin metallic hologram with a transparent
crosslinkable liquid adhesive resin; and
(f) curing the transparent liquid adhesive resin to form a tough
solvent-resistant film while it is in contact with said second side of the
thin metallic hologram.
2. A process for applying a metallic hologram to a solid substrate which
comprises the following steps in sequence:
(a) forming a thin metallic hologram on the surface of a metal die by
deposition of metal onto the surface of a metal die that contains a
holographic image, said metallic hologram having two major sides, one of
said major sides hereinafter designated: first side, being out of contact
with the surface of the metal die, the second of said major sides
hereinafter being designated: second side, being initially in contact with
the surface of the metal die;
(b) coating the first side of said thin metallic hologram with a
crosslinkable liquid adhesive resin;
(c) contacting the coating on the thin metallic hologram with a solid
substrate;
(d) curing said crosslinkable liquid adhesive resin to form a tough
solvent-resistant film while said metallic hologram and said solid
substrate are in contact with said crosslinkable liquid adhesive resin,
and said metal die is in contact with said second side;
(e) removing said metallic die from contact with said second side;
(f) coating said second side with a crosslinkable liquid adhesive resin;
and
(g) curing the coating applied in step (f) to form a tough
solvent-resistant film.
3. A process for applying a metallic hologram to a solid substrate which
comprises the following steps in sequence:
(a) forming a thin metallic hologram by deposition of a metal film onto a
thermoplastic layer and then embossing the metal film with a holographic
image, said metallic hologram having two major sides, one of said major
sides hereinafter designated: first side, being out of contact with the
thermoplastic layer, the second of said major sides hereinafter being
designated: second side, being initially in contact with the thermoplastic
layer;
(b) coating the first side of said thin metallic hologram with a
crosslinkable liquid adhesive resin;
(c) contacting the coating on the thin metallic hologram with a solid
substrate;
(d) curing said crosslinkable liquid adhesive resin to form a tough
solvent-resistant film while the first side of said metallic hologram and
said solid substrate are in contact with the crosslinkable liquid adhesive
resin and said thermoplastic layer is in contact with said second side;
(e) removing said thermoplastic layer from contact with said second side;
(f) coating said second side with a crosslinkable liquid adhesive resin;
and
(g) curing the coating applied in step (f) to form a tough
solvent-resistant film. |
|
|
|
|
Claims  |
|
|
Description  |
|
|
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a metallic reflecting hologram supported
in a transparent matrix and its method of preparation.
2. Prior Art
U.S. Pat. No. 3,658,526 discloses preparing copies of a hologram using a
photopolymer as the copy material.
U.S. Pat. No. 4,215,170 discloses a process of metallizing a substrate
wherein a transfer member is metallized by vacuum deposition of the metal,
a varnish is applied to the metal and the resulting assembly applied to
the final substrate. The varnish is cured and the transfer member is
removed leaving the metallized substrate.
U.S. Pat. No. 4,250,209 discloses a process for metallizing a substrate
wherein a polymeric film is treated with a release agent, and a layer of
metal is vacuum deposited over the release agent. An adhesive is applied
to the metal, the adhesive is adhered to a substrate, and the polymeric
film removed.
U.S. Pat. No. 4,313,984 discloses a laminated identity card containing core
layers carrying security markings.
SUMMARY OF THE INVENTION
The present invention discloses a metallic reflecting hologram and its
preparation by use of a die having a holographic image formed in the
embossing surface thereof. Using the die, an image is replicated into a
metallic film. A plastic adhesive is applied as a liquid to the metal
hologram (film) and the metal hologram applied to a substrate and the
liquid adhesive cured to convert it to a solid. A liquid is applied to the
hologram surface and cured to convert it to a solid.
DESCRIPTION OF THE DRAWINGS
FIG. 1 is a pictorial representation of the process steps carried out in
accordance with Example 1.
FIG. 2 is a pictorial representation of the process steps carried out in
accordance with Example 3.
DETAILED DESCRIPTION
The metallic holograms of the present invention can be applied to any flat
surface. Suitable surfaces include, but are not limited to, paper, wood,
sheet metal, glass, plastic films, Tyvek.RTM. (a spunbonded polyolefin
sheet material sold by Du Pont), etc. Generally the holograms of the
present invention are useful in marking valuable documents such as money
or passports to prevent their being counterfeited and for mass media
images (illustrations) in magazines, books, or on advertising material.
The first step in producing the metallic holograms of the present invention
is to prepare a die for forming the hologram. The master from which the
die is fabricated is prepared by conventional means. The preferred method
is to coat an incompletely cross-linked photopolymer on a glass plate. The
light from a laser is split into two beams which are collimated. One
collimated beam is reflected from the object to be holographed onto the
partially cross-linked photopolymer. The other beam of collimated light is
transmitted directly onto the partially cross-linked photopolymer and
serves as a reference beam. Upon exposure, the photopolymer forms a
pattern of raised areas and valleys which are a holograph of the object
being holographed. The holograph is sprayed with colloidal silver, placed
in a bath, and electroplated with nickel. The thusly formed nickel die is
separated from the master and mounted on a pressure roll or other stamping
means.
The metal hologram can be fabricated using the die by any of several means.
One method is to vacuum deposit a metal layer directly on the die. Liquid
adhesive is applied over the metallized die. The adhesive-coated metal
layer, while still attached to the die, is then pressed against a
substrate, the adhesive cured, and the die removed. The resulting metal
hologram may then be covered with additional liquid adhesive, which is
cured after application, to provide protection for the hologram.
Another method for producing the metallic hologram is to metallize a
plastic film by vacuum metallization or by sputtering. The deposited metal
may be continuous or discontinuous. The metallized film is embossed on the
metallized surface using the die. A liquid adhesive is applied to the
metallized surface, and the adhesive-coated surface of the composite is
pressed against a substrate. The adhesive is cured and the plastic film
removed. The embossed metal hologram is covered with a layer of the liquid
adhesive which is cured to complete the process.
Another technique for forming the metallic hologram is to emboss a
thermoplastic film with the die and then vacuum deposit a metal onto the
embossed film. A liquid adhesive is applied to the deposited metal; the
film, metal and adhesive is pressed against a substrate and the adhesive
cured. The film is removed and the metal hologram covered with more of the
liquid adhesive which is cured to solidify it.
Any transparent adhesive which is a liquid curable to a solid can be used
in the present invention. In a preferred aspect the adhesive is a
cross-linkable polymer that cures to form a tough solvent-resistant film.
Suitable adhesives include, but are not limited to, epoxy resins,
polyurethane resins, acrylic resins, and alkyd resins.
The metal hologram is very thin, about 0.02 to 0.1 micron in thickness.
This thinness is necessary when using the two film transfer techniques
described above because the metal surface which was not in contact with
the die surface will ultimately be the reflective holographic surface; and
if the metal is much thicker, it will not adequately reproduce the
detailed topology of the holographic master from which the die was
fabricated. Aluminum and nickel base alloys such as Hastelloy.RTM. are the
preferred metals.
Since the holographic image information is contained in the wave pattern,
it would be possible to "pirate" the image by making an electroform or
casting of the wave surface. To prevent such a counterfeiting ploy, the
wave pattern must be covered with a protective layer. Additionally, this
protective layer should have chemical characteristics similar to the
adhesive (i.e., solubility, adhesion). Such is preferred to prevent the
removal of the protective layer. For example, if various solvents are
tried to dissolve the protective layer, the adhesive layer will be
destroyed as well, thus preventing access to the image. The use of the
protective layer could, of course, be eliminated for end uses that do not
require high security. In such cases, the metal should be resistant to
oxidation and the elements. Hastelloy.RTM. has been found to be quite
durable and is suitable for direct exposure to the elements. Otherwise,
aluminum is adequate for the metal when it is covered by the protective
layer.
EXAMPLES
A biaxially oriented 1 mil thick polyethylene terephthalate film was vacuum
metallized with 0.025 micron aluminum using a conventional commercial
metallizing unit. The vacuum vessel was set to 0.012 mm Hg rather than
0.002 mm Hg so to produce a product with a low metal-to-film adhesion.
The metallized film was then embossed on the metallized surface with the
desired holographic image. Equipment for this embossing process comprised
two steel rolls heated to 90.degree. C. One of the rolls was covered with
a nickel sleeve which was electroformed from a photopolymer coated glass
plate hologram. The film to be embossed is fed between the pressure loaded
rollers with the metallized side against the nickel sleeve.
Next, equal parts of epoxy FE-7235A and B (H. B. Fuller Co.) structural
adhesive were mixed. This is a very clear epoxy resin that has appropriate
optical, viscosity, adhesion, and flexibility characteristics for use in
the present invention. The mixed resin was then applied evenly to the
image areas on the metallized side of the polyester film. Then the film
was cut up and individual image areas were pressed onto a variety of
surfaces which were ultimately to support the holographic image. Among the
surfaces were notebook paper, cardboard, and Tyvek.RTM.. Pressure was
maintained on the film/adhesive/substrate surface sandwich by use of
weights. The adhesive resin was cured by heating at 60.degree. C. for
three hours. The polyethylene terephthalate film was peeled off of the
images by hand. Left behind were exact replicas of the original
holographic image on the support surface complete with reflecting aluminum
surfaces.
Finally, a fresh batch of the epoxy resin was made as before. The
transferred surfaces were then smoothly top coated with the resin and
cured at 60.degree. C. for one hour. The resulting images were bright and
very durable.
EXAMPLE 2
Example 1 is repeated except Spensole.RTM. L53 moisture cure urethaneresin
(Spencer Kellogg Co.) (no further description available) is substituted
for the two part epoxy resin and cured at the same conditions as used for
Ex. 1.
EXAMPLE 3
Biaxially oriented polypropylene film of 2 mil thickness was embossed with
the embossing rolls used in Example 1 heated to 72.degree. C. The embossed
film was vacuum metallized with aluminum using a conventional metallizing
unit at the standard vacuum setting to provide a 0.025 micron thick
aluminum coating.
Next, equal parts of epoxy FE-7235A and B were mixed. The mixed resin was
applied evenly to the image areas on the metallized side of the
polypropylene film. The film was cut up and the image areas were pressed
on to various surfaces which were ultimately to support the holographic
image. Among the surfaces were notebook paper, cardboard, and Tyvek.RTM..
Pressure was maintained on the film of resin/substrate surface sandwich by
means of weights. The adhesive resin was cured by heating at 60.degree. C.
for three hours.
The polypropylene film was peeled off the images by hand. Left behind were
exact replicas of the original holographic image on the support surface
complete with reflecting aluminum surface.
Finally, a fresh batch of the epoxy resin is made as before. The
transferred surface was then smoothly top coated with the resin and cured
at 60.degree. C. for one hour. The resulting images were bright and very
durable.
Using these techniques, a hologram similar in size and complexity to the
Department of the Treasury seal found on the face of U.S. currency was
applied to the surface of security paper as described in U.S 4,310,591.
The image was bright and durable and judged acceptable for its intended
use as an anti-counter-fitting device.
* * * * *
|
|
|
|
|
Description  |
|