The vacuum chuck, which is an accessory device for holding a workpiece in machining and inspection, has a suction head made of a porous sintered particles of a thermoplastic resin, e.g., a fluorocarbon resin, preferably, bonded to the chuck base. The suction head is free from the problem of unreliableness of holding of workpieces without the danger of damaging the workpiece. The outer peripheral surfaces of the sucking head are provided with an air-impermeable layer to increase the efficiency of suction by preventing leakage of vacuum. The water-and-oil-resistance of the suction head can be improved by blending the powder of the thermoplastic resin with a powder of a thermosetting resin, e.g., epoxy resin.
A vacuum chuck (10) holds a semiconductor wafer (56) securely in place during manufacturing processes. An external chuck (12) has a hollow center portion receiving a spindle support (14) and shaft (16). A positive pressure is applied through the shaft to a nozzle assembly (26) that rests on the spindle support. The nozzle assembly is further housed within a cavity in an internal chuck (28) that rests within a cup in the external chuck. The nozzle assembly use a venturi jet (44) to convert the positive pressure to a vacuum. A plurality of vacuum ports (34 and 36) from the cavity of the internal chuck transfer the vacuum to an upper surface (40) of the internal chuck to hold the semiconductor wafer in place. A plurality of exhaust ports (30 and 32) from the cavity of the internal chuck exhaust gases radially across the upper surface (13) of the external chuck toward its perimeter to prevent undesired chemicals from reaching the underside of the semiconductor wafer.
The invention pertains to a cutting device, particularly for the cutting of predetermined breaking points in plastic membranes, foils or the like, with an air-permeable supporting surface for the plastic membrane or the like and with an aspirating device, with which the plastic membrane or the like is applied onto the supporting surface. The supporting surface is formed by a sintered metal plate.
A method is provided for processing a lead frame. Generally, a first surface of a lead frame base tape is placed on a first surface of the lead frame. A second surface of the lead frame base tape is placed on a first surface of a porous block. A vacuum is placed on a second surface of the porous block. A device for processing lead frames comprises a porous block with a first side and a second side, and a vacuum system connected to the first side of the porous block. The device may also include devices for attaching chips to the lead frame and wire bonding the chips to the lead frame.
A processing apparatus contains a holding member for holding a workpiece, and a laser beam shining member for shining a laser beam at the workpiece held on the holding member. The holding member has a holding plate and the workpiece is placed on the holding plate. The holding plate is composed of a plate-shaped body formed from polychlorotrifluoroethylene, and a film formed from polytetrafluoroethylene is superposed on an upper surface of the plate-shaped body.
A method is provided for processing a lead frame. Generally, a first surface of a lead frame base tape is placed on a first surface of the lead frame. A second surface of the lead frame base tape is placed on a first surface of a porous block. A vacuum is placed on a second surface of the porous block. A device for processing lead frames comprises a porous block with a first side and a second side, and a vacuum system connected to the first side of the porous block. The device may also include devices for attaching chips to the lead frame and wire bonding the chips to the lead frame.
