A vacuum pickup tool (10) having a handle (16) and a barrel (22) mounted thereto with a tip (24) that is heated by a temperature control unit (114). The barrel (22) and tip (24) include a longitudinal axial bore (41) attached to an air source through connector (116) to provide vacuum through an axial opening (62) and the tip (24) to hold a Z-clip (74) to the barrel (22). Actuation of a trigger (28) deactivates the vacuum and simultaneously heats the tip (24) to solder the clip (74) onto a wire wrapped pin (64) inserted through a circuit board (66). A thermocouple (54) and controller 114 monitor and control the temperature of the tip (24) as preset by the temperature control (114) on an instrument assembly (96).
A soldering pliers construction 10 including a pair of pivoted handle members 20, 21 having anvil members 30, 40 provided on their outboard ends. Each of the anvil members 30, 40 are provided with at least one pair of complementary lateral grooves 32, 42 which are dimensioned to receive the abutted ends of two lengths of wire 100, 100' which are to be joined together by a soldered connection. One of the anvil members 30 is provided with a heating element 34 for heating the butted wires 100, 100' and the other anvil member 40 is provided with an aperture 45 that is dimensioned to receive a stick of soldering material 200 that will be melted upon contact with the heated wires 100, 100'.
An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.
A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is secured a quick connect mechanism for mounting a heating nozzle. The heater sub-assembly is enclosed in a shroud and is secured to the end of the handle by a thermal insulating ring, such shroud housing a ceramic rod having elongated bosses on which a heating element is secured, while a laminar flow equilizer is used to provide more uniform gas flow across the heating element. Quick connect mechanism is secured to the heater sub-assembly shroud and uses a spring loaded winged locking mechanism to the secure heating nozzles to the heater head. In one embodiment, the heating nozzles have a truncated pyramid shaped chamber to which individual end nozzles are attached for directing gas flow.
