There is described an optical sensing device, a method for controlling operation of an optical sensing device comprising a light source for illuminating a surface portion with radiation, a photodetector device having at least one photosensitive element responsive to radiation reflected from the illuminated surface portion, and conversion means for integrating an output signal of said at least one photosensitive element over time during an integration period of variable duration, which duration depends on power of the light source and level of radiation reflected from the illuminated surface portion. The optical sensing device further comprises a regulating system for controlling power if the light source as a function of a comparison between a parameter representative of the evolution of the integration of the output signal of the said at least one photosensitive element and at least one reference value. Regulation is advantageously performed by timing the duration of the integration period or by determining the rate of evolution of the integrated signal, comparing this duration or rate of evolution with at least one reference value and controlling power of the light source as a function of the result of the comparison. There is also described an optical pointing device implementing the above regulation scheme as well as an optical sensing device exploiting this scheme so as to sense proximity of the illuminated surface portion with respect to the optical sensing device.

A digital range sensor comprises a light source, an optical element to focus the light from the source down to a small spot on a target, a second optical element that is mounted obliquely from the source axis, and a prism mounted on a multi-element detector, which in turn is mounted at the focus of the light returning from the target. The purpose of the prism on the detector is to direct the light onto the active surface of the detector at an angle closer to normal incidence than would otherwise be possible. The detector produces digital data which is transferred to a control module for processing and to produce a numerical range measurement.

In the context of a machine-vision system for inspecting a part, a method and apparatus to provide high-speed high accuracy 3D (three-dimensional) inspection of manufactured parts by reducing vibration. One system includes a machine-base unit and a table-base portion supported by the base unit. At least two upright portions are connected to the table-base portion. A first scanner support is coupled to the upright portions. An imager head is coupled to the scanner support, wherein the scanner support moves the imager head in a linear motion to scan the object. A connecting member including at least one vibration-absorbing portion connects to the upright portions to absorb vibrations of the upright portions. Also described is a method of reducing vibration in a three-dimensional scanning apparatus used to determine a geometry of an object having at least one surface to be measured, the scanning apparatus having two or more upright portions and a scanning mechanism coupled the upright portions for moving an imaging head. The method includes supporting the scanning mechanism on the upright portions, dampening vibrations of the upright portions, scanning the imaging head relative to the object, receiving image signals representing a three-dimensional geometry of the object into a computer, and calculating with the computer object-geometry data representing three-dimensional geometry of the object.

Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconductor fab plant. A machine-vision system for inspecting devices includes a light source for propagating light to the device and an image detector that receives light from the device. Also included is a light sensor assembly for receiving a portion of the light from the light source. The light sensor assembly produces an output signal responsive to the intensity of the light received at the light sensor assembly. A controller controls the amount of light received by the image detector to a desired intensity range in response to the output from the light sensor. The image detector may include an array of imaging pixels. The imaging system may also include a memory device which stores correction values for at least one of the pixels in the array of imaging pixels. To minimize or control thermal drift of signals output from an array of imaging pixels, the machine-vision system may also include a cooling element attached to the imaging device. The light source for propagating light to the device may be strobed. The image detector that receives light from the device remains in a fixed position with respect to the strobed light source. A translation element moves the strobed light source and image detector with respect to the device. The strobed light may be alternated between a first and second level.

Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconductor fab plant. A machine-vision system for inspecting devices includes a flipper mechanism. After being inspected at a first station, a tray-transfer device moves the tray from the first inspection station to a flipper mechanism. The flipper mechanism includes two jaws, a mover, and a rotator. The flipper mechanism turns the devices over and places the devices in a second tray so that another surface of the device can be inspected. A second tray-transfer device moves the second tray from the flipper to a second inspection station. The mover of the flipper mechanism removes the tray from the first inspection surface and places a tray at the second inspection surface.