A shield for protecting electrostatic discharge sensitive components from static electricity. The shield includes a screen formed of a static electricity dissipative material. A housing is provided from which and to which the screen can be extended and retracted. A motor may be incorporated in the shield to extend and retract the screen. Eyebolts are included for hanging and anchoring the shield. In an alternative embodiment, the shield is hung on a stand having a bracket with a hook.

A container is described which is useful for handling, storing, and shipping various packaged circuits (e.g., integrated circuits) including dual-in-line plastic (DIP) packages and dual-in-line ceramic (DIC) packages. The containers have a hump like structure shaped to accommodate the dual-in-line packages and have a conducting strip along each side of the container. With the container in an open position, the packages are free to slide along the hump-like structure which facilitates loading and unloading packaged circuits. When the container is in a closed position, the conducting strips press against the pins of the packaged circuits providing electrical contact between each pin in a row and holding the circuit packages securely in place. The containers provide excellent protection against damage from electrical discharge, are extremely convenient for loading and unloading packaged circuits, and are relatively inexpensive.

Transparent electroconductive coating compositions, methods to prepare such coating compositions, and substrates coated with these coating compositions. The coatings are based on polymeric resins containing finely dispersed electroconductive powders. The coatings can be characterized by the following: thermoformable while retaining transparency and electrical conductivity that is insensitive to humidity; low chloride extractability, stable to exposure to isopropanol or water/soap solutions.

An anti-static package for containing and manipulating an electronic component susceptible to damage from electrostatic charges. The anti-static package is comprised of a container body and a lid, wherein the lid is adapted to allow indirect manipulation of the electronic component through the use of an adhesive surface on a compressible member attached to the lid to form an adhesive bond between the lid and the electronic component, and two camming surfaces, controlled by a user's fingers or an analogous tool The adhesive is specially selected for both its anti-static properties and the lack of residue left on the electronic component as a result of forming an adhesive bond.

A container for packaging electronic components which are susceptible to damage from electrostatic discharge or fields comprises a container made of paperboard or paper having an electrically conductive coating of electrostatic shielding material on the exterior surface thereof, and a coating of inorganic non-carbonaceous electrostatic dissipative material on the interior surface thereof. The electrically conductive coating preferably has an electrical surface resistivity of less than about 10.sup.5 ohms/square, and the inorganic, non-carbonaceous, electrostatic dissipative coating has an electrical surface resistivity of greater than about 10.sup.5 ohms/square. The electrostatic shielding material is preferably a carbonaceous material, and the non-carbonaceous, electrostatic dissipative material preferably comprises particles of amorphous silica or silica-containing material coated with antimony-doped tin oxide.